Capacitor, electric circuit, circuit board, device, and method of manufacturing capacitor
US-2026066191-A1 · Mar 5, 2026 · US
Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00)
Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G4/00 |
| Official title | Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00) |
| Display label | Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00) |
| Total patents | 50 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 2 |
| 2017 | 4 |
| 2018 | 3 |
| 2019 | 12 |
| 2020 | 9 |
| 2021 | 4 |
| 2023 | 5 |
| 2024 | 4 |
| 2025 | 3 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multilayer ceramic electronic component, method of producing same, circuit module, and electronic device
US-2025308800-A1 · Oct 2, 2025 · US
Multilayer ceramic capacitor and method of producing multilayer ceramic capacitor
US-2025308788-A1 · Oct 2, 2025 · US
Multilayer ceramic capacitor and method of manufacturing the same
US-2025166907-A1 · May 22, 2025 · US
Electrode
US-12106901-B2 · Oct 1, 2024 · US
Multilayered capacitor and manufacturing method of the same
US-2024312716-A1 · Sep 19, 2024 · US
Metallized semiconductor die and manufacturing method
US-2024194623-A1 · Jun 13, 2024 · US
Multilayer ceramic capacitor and method of manufacturing the same
US-2024177935-A1 · May 30, 2024 · US
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
US-2023253384-A1 · Aug 10, 2023 · US
Method to determine properties of a coating on a transparent film, method for manufacturing a capacitor film and device to determine properties of a coating on a transparent film
US-11703319-B2 · Jul 18, 2023 · US
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
US-11631658-B2 · Apr 18, 2023 · US
An electrode
US-2023015437-A1 · Jan 19, 2023 · US
Method of producing a multi-layer ceramic electronic component
US-11551873-B2 · Jan 10, 2023 · US
Plasma electric propulsion device
US-11092142-B2 · Aug 17, 2021 · US
Capacitor component and method for manufacturing the same
US-11062847-B2 · Jul 13, 2021 · US
Jumper cable with capacitive power enhancement and/or overvoltage protection
US-11056842-B2 · Jul 6, 2021 · US
Under-Bump-Metallization Structure and Redistribution Layer Design for Integrated Fan-Out Package with Integrated Passive Device
US-2021074694-A1 · Mar 11, 2021 · US
Semiconductor devices
US-2020411507-A1 · Dec 31, 2020 · US
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
US-10840227-B2 · Nov 17, 2020 · US
Fan-out semiconductor package
US-10833041-B2 · Nov 10, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01G4/00?
- CPC H01G4/00 is the Cooperative Patent Classification code for “Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00).”
- How many patents are filed under CPC H01G4/00 (Fixed capacitors; Processes of their manufacture (electrolytic capacitors H01G9/00))?
- Our database includes 50 publications tagged with this CPC code.
- Is patent activity under CPC H01G4/00 growing?
- Publication counts under this code: 4 in 2024 vs 3 in 2025 (latest complete years).