Method for manufacturing a device having a three-dimensional magnetic structure
US-11417448-B2 · Aug 16, 2022 · US
for applying ultrathin or granular layers (ultrathin or granular layers H01F10/007) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01F41/301 |
| Official title | {for applying ultrathin or granular layers (ultrathin or granular layers H01F10/007)} |
| Display label | for applying ultrathin or granular layers (ultrathin or granular layers H01F10/007) |
| Total patents | 6 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 2 |
| 2021 | 1 |
| 2022 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11417448-B2 · Aug 16, 2022 · US
US-10942448-B2 · Mar 9, 2021 · US
US-2019235379-A1 · Aug 1, 2019 · US
US-10310374-B2 · Jun 4, 2019 · US
US-2018052389-A1 · Feb 22, 2018 · US
US-2017278605-A1 · Sep 28, 2017 · US