Method for manufacturing a device having a three-dimensional magnetic structure

US11417448B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11417448-B2
Application numberUS-201715621122-A
CountryUS
Kind codeB2
Filing dateJun 13, 2017
Priority dateDec 16, 2014
Publication dateAug 16, 2022
Grant dateAug 16, 2022

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method for manufacturing a device having a three-dimensional magnetic structure includes applying or introducing magnetic particles onto or into a carrier element. A plurality of at least partly interconnected cavities are formed between the magnetic particles, which contact one another at points of contact, by coating the arrangement of magnetic particles and the carrier. The cavities are penetrated at least partly by the layer generated when coating, resulting in the three-dimensional magnetic structure. A conductor loop arrangement is provided on the carrier or a further carrier. When a current flows through the conductor loop, an inductance of the conductor loop is changed by the three-dimensional magnetic structure, or a force acts on the three-dimensional magnetic structure or the conductor loop by a magnetic field caused by the current flow, or when the position of the three-dimensional magnetic structure is changed, a current flow is induced through the conductor loop.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing a device comprising a three-dimensional magnetic structure, the method comprising: applying or introducing magnetic particles onto or into a carrier element, the magnetic particles comprising a size between 10 nm and 10 μm, wherein a plurality of at least partly interconnected cavities are formed between the magnetic particles, and wherein the magnetic particles contact one another at points of contact; connecting the magnetic particles at the points of contact by coating the arrangement of magnetic particles and the carrier element, wherein the cavities are penetrated at least partly by a magnetic layer generated based on coating so that the result is the three-dimensional magnetic structure, wherein coating the arrangement of magnetic particles and the carrier element is performed by atomic layer deposition to form the magnetic layer and comprises depositing a dielectric layer after forming the magnetic layer; and providing a conductor loop arrangement on the carrier element or a further carrier element, such that: when a current flows through the conductor loop arrangement, an inductance of the conductor loop arrangement is changed by the three-dimensional magnetic structure; or when a current flows through the conductor loop arrangement, a force acts on the three-dimensional magnetic structure or the conductor loop arrangement by a magnetic field caused by the current flow; or when a position of the three-dimensional magnetic structure is changed once or periodically, a current flow is induced through the conductor loop arrangement. 2. The method in accordance with claim 1 , wherein applying or introducing the magnetic particles onto or into the carrier element takes place such that the conductor loop arrangement encloses the magnetic particles at least partly or the magnetic particles enclose the conductor loop arrangement at least partly. 3. The method in accordance with claim 2 , wherein the carrier element comprises a cavity in the region of the conductor loop arrangement, and wherein the magnetic particles are introduced into the cavity such that the conductor loop arrangement encloses the magnetic particles at least partly or the magnetic particles enclose the conductor loop arrangement at least partly. 4. The method in accordance with claim 1 , wherein, when providing the conductor loop arrangement, a plurality of mutually insulated conductor loop arrangements are provided, wherein applying or introducing the magnetic particles takes place such that the plurality of conductor loop arrangements are inductively coupled to one another by means of the magnetic particles. 5. The method in accordance with claim 1 , wherein the conductor loop arrangement is pro-vided on the further carrier element, wherein the carrier element and the further carrier element are coupled to each other by means of spring elements so that a relative deflection between the carrier element and the further carrier element is caused by the force acting on the three-dimensional magnetic structure by a magnetic field caused by the current flow. 6. The method in accordance with claim 5 , wherein the carrier element is arranged to be movable and the further carrier element to be fixed. 7. The method in accordance with claim 5 , wherein the further carrier element is arranged to be movable and the carrier element to be fixed. 8. The method in accordance with claim 1 , wherein coating the arrangement of magnetic particles and the carrier element further comprises: depositing a magnetic material in an oxidized form; and reducing the magnetic material in the oxidized form in order to achieve the magnetic layer. 9. The method in accordance with claim 1 , wherein the magnetic particles comprise soft- and/or hard-magnetic materials. 10. The method in accordance with claim 1 , wherein the arrangement of magnetic particles is magnetized to a preferential direction after coating. 11. The method in accordance with claim 1 , wherein the carrier element and/or the further carrier element comprise(s) plastics, silicon, glass or ceramics. 12. The method in accordance with claim 1 , wherein the carrier element and/or the further carrier element are(is) a conductor board. 13. The method in accordance with claim 1 , wherein applying or introducing magnetic particles and/or connecting the magnetic particles take(s) place such that the three-dimensional magnetic structure comprises a circular shape comprising alternating soft- and hard-magnetic portions. 14. The method in accordance with claim 1 , wherein coating the arrangement of magnetic particles and the carrier element further comprises: depositing a magnetic material in an oxidized form in order to achieve the magnetic layer.

Assignees

Inventors

Classifications

  • H01F41/046Primary

    structurally combined with ferromagnetic material · CPC title

  • for applying ultrathin or granular layers (ultrathin or granular layers H01F10/007) · CPC title

  • with polarised armatures moving in alternate directions by reversal or energisation of a single coil system · CPC title

  • Electrical rotating micromachines · CPC title

  • with both horizontal and vertical deflecting means, e.g. raster or XY scanners (colour television using laser beams scanning a display screen H04N9/3129) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11417448B2 cover?
A method for manufacturing a device having a three-dimensional magnetic structure includes applying or introducing magnetic particles onto or into a carrier element. A plurality of at least partly interconnected cavities are formed between the magnetic particles, which contact one another at points of contact, by coating the arrangement of magnetic particles and the carrier. The cavities are pe…
Who is the assignee on this patent?
Fraunhofer Ges Forschung
What technology area does this patent fall under?
Primary CPC classification H01F41/046. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 16 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).