Magnetic device

Patent metadata

Field	Value
Publication number	US-9552918-B2
Application number	US-201414777381-A
Country	US
Kind code	B2
Filing date	Mar 10, 2014
Priority date	Mar 15, 2013
Publication date	Jan 24, 2017
Grant date	Jan 24, 2017

Abstract

Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

First claim

The invention claimed is:

1. A magnetic device comprising:
a core which is formed of a magnetic substance;
a board which is formed of an insulating substance, which has an opening portion into which the core is inserted, and which comprises first and second outer surface layers provided on both surfaces and an inner layer provided between the outer surface layers;
coil patterns which are formed of a conductor, and which are provided in the first and second outer surface layers and the inner layer of the board so as to be wound around the core;
a first heat-dissipation pattern which is formed of a conductor, which is provided to correspond to the coil pattern provided in the first outer surface layer of the board, and which is provided in the second outer surface layer;
a second heat-dissipation pattern which is formed of a conductor, which is provided to correspond to the coil pattern provided in the inner layer of the board, and which is provided in second the outer surface layer;
a first thermal inter-layer connection member which connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern which correspond to each other; and
a second thermal inter-layer connection member which connects the coil pattern of the inner layer and the second heat-dissipation pattern which correspond to each other,
wherein the coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other, and
wherein an area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

2. The magnetic device according to claim 1 ,
wherein the first heat-dissipation pattern is separated from the second heat-dissipation pattern.

3. The magnetic device according to claim 1 , further comprising:
An electrical inter-layer connection member which connects the coil patterns provided in different layers of the board with each other.

4. The magnetic device according to claim 1 , further comprising:
a third heat-dissipation pattern which is formed of a conductor provided in the second outer surface layer of the board, and which is connected to the coil pattern provided in the second outer surface layer,
wherein the third heat-dissipation pattern and the first and second heat-dissipation patterns are separated from each other, and
wherein an area of the first heat-dissipation pattern is larger than an area of the third heat-dissipation pattern.

5. The magnetic device according to claim 1 ,
wherein the second heat-dissipation pattern is provided in the second outer surface layer of the board, and
a heat radiator is attached to the second outer surface layer.

Assignees

• Omron Automotive Electronics

Inventors

• Hachiya Koji
• Kobayashi Tomoyoshi
• Yamaguchi Takashi

Classifications

• H05K2201/086

  for inductive purposes, e.g. printed inductor with ferrite core · CPC title

• H05K2201/10416

  Metallic blocks or heatsinks completely inserted in a PCB · CPC title

• H01F27/2804

  Printed windings · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H05K1/0204

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title