Coil component

Patent metadata

Field	Value
Publication number	US-2016254086-A1
Application number	US-201615054600-A
Country	US
Kind code	A1
Filing date	Feb 26, 2016
Priority date	Feb 26, 2015
Publication date	Sep 1, 2016
Grant date	—

Abstract

A coil component includes an insulation layer having a coil conductor, and a magnetic-resin composite layer disposed on the insulation layer. The magnetic-resin composite layer includes a heat-dissipating filler.

First claim

What is claimed is:

1 . A coil component, comprising:
an insulation layer comprising a coil conductor; and a magnetic-resin composite layer disposed on the insulation layer, wherein the magnetic-resin composite layer comprises a heat-dissipating filler.

2 . The coil component as set forth in claim 1 , wherein the heat-dissipating filler has a greater thermal conductivity than the magnetic-resin composite layer.

3 . The coil component as set forth in claim 1 , wherein the heat-dissipating filler is smaller than a magnetic powder in the magnetic-resin composite layer.

4 . The coil component as set forth in claim 1 , wherein the heat-dissipating filler has a plate shape.

5 . The coil component as set forth in claim 1 , wherein the heat-dissipating filler is a metal oxide comprising at least one of boron nitride (BN), alumina (Al 2 O 3 ), aluminum nitride (AlN), and magnesium oxide (MgO) mixed therein.

6 . The coil component as set forth in claim 1 , further comprising:
external electrodes disposed at upper outer corners of the insulation layer, wherein the magnetic-resin composite layer is formed between the external electrodes.

7 . The coil component as set forth in claim 1 , further comprising:
a magnetic substrate disposed below the insulation layer.

8 . The coil component as set forth in claim 1 , wherein the coil conductor comprises a first coil and a second coil electromagnetically coupled to each other.

9 . A coil conductor, comprising:
an insulation layer comprising a coil conductor installed therein; a magnetic-resin composite layer; and a heat-transferring layer comprising a greater thermal conductivity than the magnetic-resin composite layer, wherein the magnetic-resin composite layer and the heat-transferring layer are laminated successively on the insulation layer.

10 . The coil component as set forth in claim 9 , wherein the heat-transferring layer comprises a mixture of a heat-dissipating filler and a resin.

11 . The coil component as set forth in claim 10 , wherein the heat-dissipating filler has a plate shape.

12 . The coil component as set forth in claim 10 , wherein the heat-dissipating filler is a metal oxide comprises at least one of boron nitride (BN), alumina (Al 2 O 3 ), aluminum nitride (AlN) and magnesium oxide (MgO) mixed therein.

13 . The coil component as set forth in claim 9 , wherein a heat-dissipating filler is dispersed between magnetic powder in the magnetic-resin composite layer.

14 . The coil component as set forth in claim 9 , wherein the magnetic-resin composite layer of a plurality of magnetic-resin composite layers and the heat-transferring layer of a plurality of heat-transferring layers are alternately laminated.

15 . The coil component as set forth in claim 14 , wherein a heat-transferring layer among the plurality of heat-resisting layers is disposed on an uppermost layer and is externally exposed.

16 . The coil component as set forth in claim 14 , wherein a heat-dissipating filler is dispersed in at least one of the plurality of magnetic-resin composite layer.

17 . The coil component as set forth in claim 9 , further comprising:
external electrodes disposed at upper outer corners of the insulation layer, wherein the magnetic-resin composite layer and the heat-transferring layer are formed in between the external electrodes.

18 . The coil component as set forth in claim 9 , further comprising:
a magnetic substrate disposed below the insulation layer.

19 . The coil component as set forth in claim 9 , wherein the coil conductor comprises a first coil and a second coil electromagnetically coupled to each other.

Assignees

• Samsung Electro Mech

Inventors

• Kim Jin-Gu
• Ogura Ichiro
• Kim Hong-Won
• Park Seung-Wook
• Cho Jeong-Min

Classifications

• H01F27/22 Primary

  Cooling by heat conduction through solid or powdered fillings · CPC title

• H01F27/255

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F27/2804

  Printed windings · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F27/292

  Surface mounted devices · CPC title