Preparing method for conductive composite, conductive composite and piezoresistive device using the same
US-12173133-B2 · Dec 24, 2024 · US
adjustable by mechanical pressure or force
adjustable by mechanical pressure or force · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C10/10 |
| Official title | adjustable by mechanical pressure or force |
| Display label | adjustable by mechanical pressure or force |
| Total patents | 58 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 1 |
| 2017 | 7 |
| 2018 | 9 |
| 2019 | 9 |
| 2020 | 10 |
| 2021 | 7 |
| 2022 | 4 |
| 2023 | 3 |
| 2024 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Organic semiconductor element, strain sensor, vibration sensor, and manufacturing method for organic semiconductor element
US-12068093-B2 · Aug 20, 2024 · US
Distortion resistance film, pressure sensor, and layered body
US-2024170189-A1 · May 23, 2024 · US
Force sensor
US-11933681-B2 · Mar 19, 2024 · US
Methods, systems, and apparatus for simulating the change of chest impedance with passive components and electrocardiogram contamination
US-2023255537-A1 · Aug 17, 2023 · US
Preparing method for conductive composite, conductive composite and piezoresistive device using the same
US-2023212371-A1 · Jul 6, 2023 · US
Graphene/polymer heterostructure-based flexible and biocompatible pressure/strain sensor
US-11630007-B2 · Apr 18, 2023 · US
Laser-induced graphene-based bending sensor and method
US-11493321-B2 · Nov 8, 2022 · US
Strain sensor resistor
US-11443877-B2 · Sep 13, 2022 · US
Method for preparing thin film piezoresistive material, thin film piezoresistive material, robot and device
US-2022275220-A1 · Sep 1, 2022 · US
Force sensor
US-2022034731-A1 · Feb 3, 2022 · US
Film resistor and thin-film sensor
US-11177059-B2 · Nov 16, 2021 · US
Strain sensor resistor
US-2021335524-A1 · Oct 28, 2021 · US
Organic semiconductor element, strain sensor, vibration sensor, and manufacturing method for organic semiconductor element
US-2021328164-A1 · Oct 21, 2021 · US
Production of a microelectronic device collector
US-11152646-B2 · Oct 19, 2021 · US
Strain gauge
US-11087905-B2 · Aug 10, 2021 · US
Microelectromechanical scalable bulk-type piezoresistive force/pressure sensor
US-11009412-B2 · May 18, 2021 · US
Pressure-strain sensor including a graphene structure
US-11002619-B2 · May 11, 2021 · US
Graphene/Polymer Heterostructure-Based Flexible and Biocompatible Pressure/Strain Sensor
US-2020400514-A1 · Dec 24, 2020 · US
Laser-induced graphene-based bending sensor and method
US-2020348121-A1 · Nov 5, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01C10/10?
- CPC H01C10/10 is the Cooperative Patent Classification code for “adjustable by mechanical pressure or force.”
- How many patents are filed under CPC H01C10/10 (adjustable by mechanical pressure or force)?
- Our database includes 58 publications tagged with this CPC code.
- Is patent activity under CPC H01C10/10 growing?
- Publication counts under this code: 3 in 2023 vs 4 in 2024 (latest complete years).