Preparing method for conductive composite, conductive composite and piezoresistive device using the same

Patent metadata

Field	Value
Publication number	US-12173133-B2
Application number	US-202217748787-A
Country	US
Kind code	B2
Filing date	May 19, 2022
Priority date	Dec 30, 2021
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A method of preparing a conductive composite includes immersing a porous base material in a conductive coating solution, and drying the conductive coating solution on the porous base material to form a conductive coating layer on the porous base material. The conductive coating solution includes conductive particles and a solvent, and the surface tension of the solvent is lower than the surface tension of the porous base material by 8 mN/m or more, and a conductive composite is prepared therefrom.

First claim

The invention claimed is:

1. A method of preparing a conductive composite, comprising the steps of:
immersing a porous base material in a conductive coating solution; and
drying the conductive coating solution on the porous base material to form a conductive coating layer on the porous base material;
wherein the conductive coating solution includes conductive particles and a solvent;
wherein a surface tension of the solvent is lower than a surface tension of the porous base material by 8 mN/m or more; and
wherein a constituent molecules of the solvent contain at least one functional group contained in the constituent molecules of the porous base material.

2. The method of preparing the conductive composite according to claim 1 , wherein the porous base material is at least one polymer selected from the group consisting of: a polyurethane-based polymer, a polystyrene-based polymer, a polyphenol-based polymer, a polyvinyl chloride-based polymer, a polymelamine-based polymer, and a polysiloxane-based polymer, or a copolymer thereof.

3. The method of preparing the conductive composite according to claim 1 , wherein the porous base material comprises a foam having a density of 0.01 to 0.1 g/cc.

4. The method of preparing the conductive composite according to claim 1 , wherein the conductive particles comprise one or more selected from the group consisting of: carbon nanotubes (CNTs), carbon nanowires, graphene, and carbon nanoparticles.

5. The method of preparing the conductive composite according to claim 1 , wherein the surface tension of the solvent is lower than the surface tension of the porous base material by 8 mN/m or more and 15 mN/m or less.

6. The method of preparing the conductive composite according to claim 1 , wherein the porous base material comprises a polyurethane-based polymer, and the solvent comprises an ester group (—C(═O)—O—) in the molecule.

7. The method of preparing the conductive composite according to claim 6 , wherein the solvent comprises one or more selected from the group consisting of: diethylene glycol monoethyl ether acetate, propylene glycol phenyl ether, and propylene glycol monomethyl ether.

8. The method of preparing the conductive composite according to claim 1 , wherein the conductive coating solution comprises 1 to 5% by weight of the conductive particles and 60 to 80% by weight of the solvent.

9. The method of preparing the conductive composite according to claim 1 ,
wherein the conductive coating solution comprises 1 to 5% by weight of a dispersant and 5 to 25% by weight of a binder.

10. A conductive composite prepared by the method of claim 1 .

11. A piezoresistive device comprising the conductive composite of claim 10 .

12. A piezoresistive sensor or piezoresistive switch comprising the piezoresistive device of claim 11 .

Assignees

• Hyundai Motor Co Ltd
• Kia Corp

Inventors

• Song Kyong Hwa
• Kim Gwan Sik
• Yun Deok Woo
• Lee Min Jae

Classifications

• H10N30/85

  Piezoelectric or electrostrictive active materials · CPC title

• C08K5/06

  Ethers; Acetals; Ketals; Ortho-esters · CPC title

• C09D5/24 Primary

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• C08K2201/001

  Conductive additives · CPC title

• H01B1/04

  mainly consisting of carbon-silicon compounds, carbon or silicon · CPC title