Device for modifying a linear substrate
US-12485448-B2 · Dec 2, 2025 · US
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using a filling or coating cone or die
using a filling or coating cone or die · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01B13/327 |
| Official title | {using a filling or coating cone or die} |
| Display label | using a filling or coating cone or die |
| Total patents | 22 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 3 |
| 2017 | 1 |
| 2019 | 3 |
| 2021 | 3 |
| 2022 | 6 |
| 2024 | 2 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Cable preparation and injection systems and methods
US-12394542-B2 · Aug 19, 2025 · US
Device for modifying a linear substrate
US-2025256297-A1 · Aug 14, 2025 · US
Device for modifying a linear substrate
US-12103035-B2 · Oct 1, 2024 · US
Device for modifying a linear substrate
US-12097527-B2 · Sep 24, 2024 · US
Device for modifying a linear substrate
US-2022305517-A1 · Sep 29, 2022 · US
Cable preparation and injection systems and methods
US-2022285052-A1 · Sep 8, 2022 · US
Power cable with conductor strand fill containing recycled crosslinked compounds
US-11410795-B2 · Aug 9, 2022 · US
Device for modifying a linear substrate
US-2022134377-A1 · May 5, 2022 · US
Device for modifying a linear substrate
US-2022134376-A1 · May 5, 2022 · US
Device for modifying a linear substrate
US-11298719-B2 · Apr 12, 2022 · US
Power cable with conductor strand fill containing recycled crosslinked compounds
US-2021304921-A1 · Sep 30, 2021 · US
Linear substrate infusion compartment
US-2021260618-A1 · Aug 26, 2021 · US
Linear substrate processing compartment
US-11033923-B2 · Jun 15, 2021 · US
Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
US-10344385-B2 · Jul 9, 2019 · US
Linear substrate infusion compartment
US-2019193102-A1 · Jun 27, 2019 · US
Device for modifying a linear substrate
US-2019070629-A1 · Mar 7, 2019 · US
Linear substrate infusion compartment
US-9718080-B1 · Aug 1, 2017 · US
METHOD FOR FORMING CONDUCTIVE PATTERN BY DIRECT RADIATION OF ELECTROMAGNETIC WAVE, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON (As Amended)
US-2016212860-A1 · Jul 21, 2016 · US
Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
US-2016201198-A1 · Jul 14, 2016 · US