Surface treated abrasive particles for tungsten buff applications
US-11043151-B2 · Jun 22, 2021 · US
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Storage circuits (G09G1/06 - G09G1/28 take precedence)
Storage circuits (G09G1/06 - G09G1/28 take precedence) · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G09G1/02 |
| Official title | Storage circuits (G09G1/06 - G09G1/28 take precedence) |
| Display label | Storage circuits (G09G1/06 - G09G1/28 take precedence) |
| Total patents | 13 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 3 |
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 2 |
| 2021 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Shift register, gate driving circuit containing the same, and method for driving the same
US-10453546-B2 · Oct 22, 2019 · US
Surface treated abrasive particles for tungsten buff applications
US-2019100677-A1 · Apr 4, 2019 · US
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
US-10011741-B2 · Jul 3, 2018 · US
Shift register, gate driving circuit containing the same, and method for driving the same
US-2017330633-A1 · Nov 16, 2017 · US
Polishing composition for edge roll-off improvement
US-9401104-B2 · Jul 26, 2016 · US
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof
US-2016177134-A1 · Jun 23, 2016 · US
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
US-9305476-B2 · Apr 5, 2016 · US
Polishing composition for edge roll-off improvement
US-2015315417-A1 · Nov 5, 2015 · US
CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivity
US-9165489-B2 · Oct 20, 2015 · US
Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof
US-2015247063-A1 · Sep 3, 2015 · US
Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers
US-9070632-B2 · Jun 30, 2015 · US
Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof
US-9062230-B2 · Jun 23, 2015 · US