Method and Apparatus for improved Circuit Structure Thermal Reliability on Printed Circuit Board Materials
US-2021066209-A1 · Mar 4, 2021 · US
Physics
Physics · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G06F2217/40 |
| Official title | — |
| Display label | Physics (mapped technology topic) |
| Total patents | 58 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 12 |
| 2017 | 9 |
| 2018 | 9 |
| 2019 | 9 |
| 2020 | 7 |
| 2021 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Clock crossing interface for integrated circuit generation
US-2021011981-A1 · Jan 14, 2021 · US
Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit board
US-2020233934-A1 · Jul 23, 2020 · US
Bump layout for coplanarity improvement
US-2020105654-A1 · Apr 2, 2020 · US
Light source and method for making a light source
US-10598318-B1 · Mar 24, 2020 · US
Selection of die and package parasitic for IO power domain
US-10585999-B2 · Mar 10, 2020 · US
Single simulation-based structure function mapping
US-10571514-B2 · Feb 25, 2020 · US
Semiconductor devices with bump allocation
US-10541185-B2 · Jan 21, 2020 · US
Chip temperature computation method and chip temperature computation device
US-10540474-B2 · Jan 21, 2020 · US
Method of tuning components within an integracted circuit device
US-10522458-B2 · Dec 31, 2019 · US
Thermal resistance analysis model and semiconductor integrated circuit
US-10482199-B2 · Nov 19, 2019 · US
Via architecture for increased density interface
US-10475736-B2 · Nov 12, 2019 · US
Method of selecting routing resources in a multi-chip integrated circuit device
US-10467373-B2 · Nov 5, 2019 · US
Hybrid modeling for a device under test associated with a two-phase cooling system
US-10423735-B2 · Sep 24, 2019 · US
Method of selecting routing resources in a multi-chip integrated circuit device
US-2019258767-A1 · Aug 22, 2019 · US
Single Simulation-Based Structure Function Mapping
US-2019072606-A1 · Mar 7, 2019 · US
Entry finder for single layer differential group routing
US-10204204-B2 · Feb 12, 2019 · US
Methods and apparatus providing a graded package for a semiconductor
US-10170384-B2 · Jan 1, 2019 · US
Circuit design layout in multiple synchronous representations
US-10127343-B2 · Nov 13, 2018 · US
Integrated fan-out package and layout method thereof
US-10120971-B2 · Nov 6, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC G06F2217/40?
- CPC G06F2217/40 is the Cooperative Patent Classification code for “Physics.”
- How many patents are filed under CPC G06F2217/40 (Physics)?
- Our database includes 58 publications tagged with this CPC code.
- Is patent activity under CPC G06F2217/40 growing?
- Publication counts under this code: 7 in 2020 vs 2 in 2021 (latest complete years).