Hydrogen evolution electrode and preparation method thereof
US-12516423-B2 · Jan 6, 2026 · US
Electroplating characterised by the structure or texture of the layers
Electroplating characterised by the structure or texture of the layers · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/60 |
| Official title | {Electroplating characterised by the structure or texture of the layers} |
| Display label | Electroplating characterised by the structure or texture of the layers |
| Total patents | 39 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 6 |
| 2017 | 3 |
| 2018 | 6 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 3 |
| 2023 | 2 |
| 2024 | 7 |
| 2025 | 4 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bump structure and method of making the same
US-2025357145-A1 · Nov 20, 2025 · US
Bump structure and method of making the same
US-12431365-B2 · Sep 30, 2025 · US
Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate
US-2025163598-A1 · May 22, 2025 · US
Methods for electrochemical additive manufacturing of parts
US-12227862-B2 · Feb 18, 2025 · US
Methods for electrochemical additive manufacturing of parts
US-2024271304-A1 · Aug 15, 2024 · US
Bump structure and method of making the same
US-2024266190-A1 · Aug 8, 2024 · US
Surface treated steel foil
US-2024229284-A1 · Jul 11, 2024 · US
Bump structure and method of making the same
US-12033870-B2 · Jul 9, 2024 · US
Surface treated steel foil for current collector
US-2024222645-A1 · Jul 4, 2024 · US
Coating Structure Comprising Graphite Alloy and Preparation Method
US-2024191387-A1 · Jun 13, 2024 · US
Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate
US-11920251-B2 · Mar 5, 2024 · US
Hydrogen evolution electrode and preparation method thereof
US-2023203675-A1 · Jun 29, 2023 · US
Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate
US-2023070048-A1 · Mar 9, 2023 · US
Bump structure and method of making the same
US-2022351983-A1 · Nov 3, 2022 · US
Bump structure and method of making the same
US-11417539-B2 · Aug 16, 2022 · US
Floating metallized element assembly and method of manufacturing thereof
US-11326268-B2 · May 10, 2022 · US
Bump structure and method of making the same
US-2021272819-A1 · Sep 2, 2021 · US
Particle matter analysis device, analysis method and manufacturing method thereof
US-2021109005-A1 · Apr 15, 2021 · US
Method and apparatus for electrolytically depositing a deposition metal on a workpiece
US-10774437-B2 · Sep 15, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/60?
- CPC C25D5/60 is the Cooperative Patent Classification code for “Electroplating characterised by the structure or texture of the layers.”
- How many patents are filed under CPC C25D5/60 (Electroplating characterised by the structure or texture of the layers)?
- Our database includes 39 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/60 growing?
- Publication counts under this code: 7 in 2024 vs 4 in 2025 (latest complete years).