Composition for cobalt plating comprising additive for void-free submicron feature filling
US-12098473-B2 · Sep 24, 2024 · US
Acetylenic compounds
Acetylenic compounds · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D3/16 |
| Official title | Acetylenic compounds |
| Display label | Acetylenic compounds |
| Total patents | 38 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 1 |
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 3 |
| 2020 | 4 |
| 2021 | 9 |
| 2022 | 9 |
| 2023 | 2 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Cobalt chemistry for smooth topology
US-11807951-B2 · Nov 7, 2023 · US
Composition for cobalt or cobalt alloy electroplating
US-11585004-B2 · Feb 21, 2023 · US
Composition for Cobalt Electroplating Comprising Leveling Agent
US-2022298664-A1 · Sep 22, 2022 · US
Cobalt filling of interconnects in microelectronics
US-11434578-B2 · Sep 6, 2022 · US
Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating
US-11408085-B2 · Aug 9, 2022 · US
Cobalt filling of interconnects
US-11401618-B2 · Aug 2, 2022 · US
Composition for cobalt electroplating comprising leveling agent
US-11377748-B2 · Jul 5, 2022 · US
Cobalt chemistry for smooth topology
US-2022136123-A1 · May 5, 2022 · US
Galvanic nickel or nickel alloy electroplating bath for depositing a semi- bright nickel or semi-bright nickel alloy coating
US-2022098747-A1 · Mar 31, 2022 · US
Cobalt chemistry for smooth topology
US-11230778-B2 · Jan 25, 2022 · US
Composition for cobalt plating comprising additive for void-free submicron feature filling
US-2022018035-A1 · Jan 20, 2022 · US
Deposition method of Ni—P—B system electroplating film, the film, and slide member comprising the film
US-11193215-B2 · Dec 7, 2021 · US
Cobalt Filling of Interconnects
US-2021332491-A1 · Oct 28, 2021 · US
Cobalt Filling of Interconnects in Microelectronics
US-2021222314-A1 · Jul 22, 2021 · US
Cobalt chemistry for smooth topology
US-2021180200-A1 · Jun 17, 2021 · US
Cobalt filling of interconnects
US-11035048-B2 · Jun 15, 2021 · US
Composition for cobalt or cobalt alloy electroplating
US-2021147994-A1 · May 20, 2021 · US
Cobalt filling of interconnects in microelectronics
US-10995417-B2 · May 4, 2021 · US
Deposition method of ni-p-b system electroplating film, the film, and slide member comprising the film
US-2021054517-A1 · Feb 25, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D3/16?
- CPC C25D3/16 is the Cooperative Patent Classification code for “Acetylenic compounds.”
- How many patents are filed under CPC C25D3/16 (Acetylenic compounds)?
- Our database includes 38 publications tagged with this CPC code.
- Is patent activity under CPC C25D3/16 growing?
- Publication counts under this code: 2 in 2023 vs 1 in 2024 (latest complete years).