Deposition method of ni-p-b system electroplating film, the film, and slide member comprising the film

Patent metadata

Field	Value
Publication number	US-2021054517-A1
Application number	US-201816493207-A
Country	US
Kind code	A1
Filing date	Mar 14, 2018
Priority date	Apr 20, 2017
Publication date	Feb 25, 2021
Grant date	—

Abstract

In a deposition method of Ni—P—B system plating film, electroplating is performed in a plating bath containing Ni ions, phosphorous acid ions, alkylamine borane, acetic acid, at least one sort of a primary brightening agent, and a secondary brightening agent including at least one sort of a surface active agent. In the above-mentioned plating bath, concentration of alkylamine borane in said plating bath is 1.37 mmol/L or more, and concentration of acetic acid in said plating bath is 0.70 mol/L or more and less than 2.80 mol/L. Thereby, plating film having high hardness of Hv 700 or more can be deposited with high manufacturing efficiency without baking processing, while reducing occurrence of poor appearance, such as burning and abnormal precipitation, even when current density is increased to 80 A/dm 2 or more to raise deposition rate.

First claim

1 . A deposition method of Ni—P—B system plating film, wherein:
electroplating is performed in a plating bath containing Ni ions, phosphorous acid ions, alkylamine borane, acetic acid, at least one sort of a primary brightening agent, and a secondary brightening agent including at least one sort of a surface active agent,
concentration of alkylamine borane in said plating bath is 1.37 mmol/L or more, and
concentration of acetic acid in said plating bath is 0.70 mol/L or more and less than 2.80 mol/L.

2 . The deposition method of Ni—P—B system plating film according to claim 1 , wherein:
said alkylamine borane is trialkyl amine borane or dialkyl amine borane, and
said surface active agent is anionic surface active agent.

3 . The deposition method of Ni—P—B system plating film according to claim 2 , wherein:
said alkylamine borane is trimethylamine borane or dimethylamine borane, and
said surface active agent is sodium dodecyl sulfate.

4 . The deposition method of Ni—P—B system plating film according to claim 1 , wherein:
current density is 80 A/dm2 or more when performing said electroplating.

5 . Ni—P—B system plating film, wherein:
a content rate of Ni is 90 at % or more and 98 at % or less,
a content rate of P is 1 at % or more and 9 at % or less,
a content rate of B is 0.1 at % or more and less than 1 at %,
hardness of said Ni—P—B system plating film is Hv 700 or more, and
a size of a crystallite measured by X-ray diffraction of said Ni—P—B system plating film is 4 nm or more and 10 nm or less.

6 . The Ni—P—B system plating film according to claim 5 , wherein:
a content rate of C is 0.1 at % or more, and
a content rate of S is 0.1 at % or more.

7 . A slide member which comprises plating film formed at least on a surface of a sliding part, wherein:
in said plating film is Ni—P—B system plating film, a content rate of Ni is 90 at % or more and 98 at % or less, a content rate of P is 1 at % or more and 9 at % or less, a content rate of B is 0.1 at % or more and less than 1 at %, and hardness of said Ni—P—B system plating film is Hy 700 or more, and a size of crystallite measured by X-ray diffraction of said Ni—P—B system plating film is 4 nm or more and 10 nm or less.

Assignees

• Aisin Seiki

Inventors

• Sasayama Hiroaki

Classifications

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C25D3/16 Primary

  Acetylenic compounds · CPC title

• C25D3/18

  Heterocyclic compounds · CPC title

• C25D7/10

  Bearings · CPC title

• C25D3/12 Primary

  of nickel or cobalt · CPC title