Etching solution for selectively removing silicon nitride during manufacture of a semiconductor device
US-11186771-B2 · Nov 30, 2021 · US
Etching compositions (C23F1/44 takes precedence)
Etching compositions (C23F1/44 takes precedence) · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F1/10 |
| Official title | Etching compositions (C23F1/44 takes precedence) |
| Display label | Etching compositions (C23F1/44 takes precedence) |
| Total patents | 97 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 4 |
| 2017 | 7 |
| 2018 | 8 |
| 2019 | 7 |
| 2020 | 15 |
| 2021 | 11 |
| 2022 | 10 |
| 2023 | 9 |
| 2024 | 8 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Contact etchback in room temperature ionic liquid
US-11145544-B2 · Oct 12, 2021 · US
Method for reducing surface roughness
US-11118268-B2 · Sep 14, 2021 · US
Semiconductor Device and Method of Manufacture
US-2021225660-A1 · Jul 22, 2021 · US
Etching composition, method for etching insulating layer of semiconductor devices and method for preparing semiconductor devices
US-11028321-B2 · Jun 8, 2021 · US
Polishing composition and polishing method using the same
US-11008482-B2 · May 18, 2021 · US
Etching compositions
US-2021102121-A1 · Apr 8, 2021 · US
Etching compositions
US-10961453-B2 · Mar 30, 2021 · US
Porous materials comprising two-dimensional nanomaterials
US-10953467-B2 · Mar 23, 2021 · US
Heat storage apparatus, method for storing heat, and method for producing heat storage apparatus
US-10921064-B2 · Feb 16, 2021 · US
Patterning Paste
US-2021032489-A1 · Feb 4, 2021 · US
Treatment liquid and treatment method
US-2020363725-A1 · Nov 19, 2020 · US
Etching solution, additive, and etching method
US-2020308485-A1 · Oct 1, 2020 · US
Etching metal using n-heterocyclic carbenes
US-2020283911-A1 · Sep 10, 2020 · US
Evaporation mask and manufacturing method thereof
US-2020270740-A1 · Aug 27, 2020 · US
Polishing compositions and methods of use thereof
US-2020224058-A1 · Jul 16, 2020 · US
Polishing compositions and methods of use thereof
US-10703937-B2 · Jul 7, 2020 · US
Etchant composition for etching metal film and method of forming pattern using the same
US-2020208052-A1 · Jul 2, 2020 · US
Etchant composition and methods for manufacturing metal pattern and array substrate using the same
US-2020172807-A1 · Jun 4, 2020 · US
Polishing composition and polishing method using the same
US-2020165487-A1 · May 28, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F1/10?
- CPC C23F1/10 is the Cooperative Patent Classification code for “Etching compositions (C23F1/44 takes precedence).”
- How many patents are filed under CPC C23F1/10 (Etching compositions (C23F1/44 takes precedence))?
- Our database includes 97 publications tagged with this CPC code.
- Is patent activity under CPC C23F1/10 growing?
- Publication counts under this code: 8 in 2024 vs 9 in 2025 (latest complete years).