Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

Patent metadata

Field	Value
Publication number	US-9167704-B2
Application number	US-51765209-A
Country	US
Kind code	B2
Filing date	Dec 13, 2006
Priority date	Dec 13, 2006
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the region of 175° C., the solder alloy having a Silver weight % in the range of 3.5 to 7.0, a Copper weight % in the range of 1.0 to 4.0, and an Antimony weight % in the range of 1.0 to 3.0. Other embodiments are described and claimed.

First claim

What is claimed is:

1. A premelted solid lead-free wire-form solder for use in forming solder joints in an electronic system of a well logging tool, the lead-free wire-form solder having a preliminary solid alloy composition comprising:
Silver;
Copper;
Antimony; and
Tin;
wherein the solder alloy composition has a weight % of the Silver in a range of 3.5 to 7.0, a weight % of the Copper in a range of 1.0 to 4.0, and a weight % of the Antimony in a range of 1.0 to 3.0, and the remainder Tin.

2. The premelted solid lead-free wire-form solder as set forth in claim 1 , wherein the preliminary solid solder alloy composition comprises about 4.7 weight % Silver, about 1.7 weight % Copper, and about 1.5 weight % Antimony, and the remainder Tin.

3. The premelted solid lead-free wire-form solder as set forth in claim 1 , wherein the preliminary solid solder alloy composition has a weight % of the Tin in a range of 86.0 to 94.5.

4. The premelted solid lead-free wire-form solder of claim 1 , wherein the preliminary solder alloy composition further comprises at least 0.1 weight % Zinc.

5. The premelted solid lead-free wire-form solder as set forth in claim 4 , wherein the preliminary solder alloy composition comprises a weight % of the Zinc in a range of 0.1 to 1.0.

Assignees

• Hrametz Andy A
• Duncan Alex T
• Halliburton Energy Services Inc

Inventors

• Hrametz Andy A
• Duncan Alex T

Classifications

• H05K3/346 Primary

  Solder materials or compositions specially adapted therefor · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• E21B49/00

  Testing the nature of borehole walls; Formation testing; Methods or apparatus for obtaining samples of soil or well fluids, specially adapted to earth drilling or wells · CPC title