Adhesive tape for semiconductor processing and method for producing semiconductor device
US-2019385889-A1 · Dec 19, 2019 · US
characterised by a primer layer between the carrier and the adhesive · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J7/50 |
| Official title | characterised by a primer layer between the carrier and the adhesive |
| Display label | characterised by a primer layer between the carrier and the adhesive |
| Total patents | 268 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 8 |
| 2017 | 10 |
| 2018 | 20 |
| 2019 | 19 |
| 2020 | 39 |
| 2021 | 29 |
| 2022 | 38 |
| 2023 | 28 |
| 2024 | 27 |
| 2025 | 33 |
| 2026 | 6 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2019385889-A1 · Dec 19, 2019 · US
US-2019367781-A1 · Dec 5, 2019 · US
US-2019367661-A1 · Dec 5, 2019 · US
US-10385238-B2 · Aug 20, 2019 · US
US-2019218423-A1 · Jul 18, 2019 · US
US-2019218425-A1 · Jul 18, 2019 · US
US-2019144726-A1 · May 16, 2019 · US
US-2019136097-A1 · May 9, 2019 · US
US-10259258-B2 · Apr 16, 2019 · US
US-2019092983-A1 · Mar 28, 2019 · US
US-2019023951-A1 · Jan 24, 2019 · US
US-2018327638-A1 · Nov 15, 2018 · US
US-2018322811-A1 · Nov 8, 2018 · US
US-10113089-B2 · Oct 30, 2018 · US
US-2018308739-A1 · Oct 25, 2018 · US
US-2018265740-A1 · Sep 20, 2018 · US
US-2018223124-A1 · Aug 9, 2018 · US
US-10026858-B2 · Jul 17, 2018 · US
US-10005257-B2 · Jun 26, 2018 · US
US-2018163096-A1 · Jun 14, 2018 · US
Answers are generated from the same data shown on this page.