Film-form adhesive, adhesive film, integrated dicing/die bonding film, and method for manufacturing semiconductor device
US-2025293192-A1 · Sep 18, 2025 · US
Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00 · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J119/00 |
| Official title | Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00 |
| Display label | Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00 |
| Total patents | 21 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2016 | 4 |
| 2017 | 2 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 2 |
| 2022 | 2 |
| 2025 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2025293192-A1 · Sep 18, 2025 · US
US-2025289980-A1 · Sep 18, 2025 · US
US-11401445-B2 · Aug 2, 2022 · US
US-11401444-B2 · Aug 2, 2022 · US
US-2021079270-A1 · Mar 18, 2021 · US
US-2021009862-A1 · Jan 14, 2021 · US
US-2020399510-A1 · Dec 24, 2020 · US
US-10731061-B2 · Aug 4, 2020 · US
US-2020055649-A1 · Feb 20, 2020 · US
US-10457455-B2 · Oct 29, 2019 · US
US-10259910-B2 · Apr 16, 2019 · US
US-2018320035-A1 · Nov 8, 2018 · US
US-2018273688-A1 · Sep 27, 2018 · US
US-10047252-B2 · Aug 14, 2018 · US
US-9982809-B2 · May 29, 2018 · US
US-9708511-B2 · Jul 18, 2017 · US
US-2017191586-A1 · Jul 6, 2017 · US
US-2016200948-A1 · Jul 14, 2016 · US
US-2016177143-A1 · Jun 23, 2016 · US
US-9296927-B2 · Mar 29, 2016 · US