Film-form adhesive, adhesive film, integrated dicing/die bonding film, and method for manufacturing semiconductor device
US-2025293192-A1 · Sep 18, 2025 · US
US9708511B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9708511-B2 |
| Application number | US-201414912602-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 29, 2014 |
| Priority date | Aug 27, 2013 |
| Publication date | Jul 18, 2017 |
| Grant date | Jul 18, 2017 |
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The present invention relates to an adhesive composition including: a butyl-based rubber; and a tackifier having a softening point of 90° C. or more.
Opening claim text (preview).
The invention claimed is: 1. An adhesive composition comprising: a butyl-based rubber; a tackifier having a softening point of 90° C. or more; and a curing agent selected from the group consisting of an acrylate resin, a methacrylate resin, an isocyanate resin, a melamine resin, a urethane resin, an epoxy resin, an acid anhydride, a polyamine resin, and a carboxy group-containing polymer, wherein the butyl-based rubber has an amount of 50 wt % to 70 wt % relative to total weight of the adhesive composition, the tackifier has an amount of 5 wt % to 10 wt % relative to total weight of the adhesive composition, and the butyl-based rubber includes repeat units derived from isoprene having an amount of 1 mol % to 5 mol % of the total repeat unit. 2. The adhesive composition of claim 1 , wherein the butyl-based rubber includes at least one selected from the group consisting of a butyl rubber, a bromo-butyl rubber, and a chlorinated butyl rubber. 3. The adhesive composition of claim 1 , wherein the butyl-based rubber has a weight average molecular weight of 50,000 to 2,000,000. 4. The adhesive composition of claim 1 , wherein the tackifier is a rosin-based resin, a rosin ester-based resin, a linear hydrocarbon-based resin or a cyclic olefin-based resin to which hydrogen is added. 5. The adhesive composition of claim 1 , wherein the tackifier has a weight average molecular weight of 500 to 2,000. 6. The adhesive composition of claim 1 , further comprising: at least one selected from the group consisting of a UV stabilizer, a photoinitiator, a thermal initiator, an antioxidant, a filler and a plasticizer. 7. The adhesive composition of claim 1 , wherein a water vapor transmission rate (WVTR) of the adhesive composition is 10 g/m 2 ·24 hr at a temperature of 38° C. and relative humidity of 90%. 8. The adhesive composition of claim 1 , wherein the curing agent is hexane-1,6-diol diacrylate (HDDA).
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Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00 · CPC title
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