Epoxy resin composition and cured product thereof
US-2024254279-A1 · Aug 1, 2024 · US
Boron-containing compounds {(C08K5/0091 takes precedence)}
Boron-containing compounds {(C08K5/0091 takes precedence)} · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08K5/55 |
| Official title | Boron-containing compounds {(C08K5/0091 takes precedence)} |
| Display label | Boron-containing compounds {(C08K5/0091 takes precedence)} |
| Total patents | 415 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 22 |
| 2016 | 25 |
| 2017 | 42 |
| 2018 | 36 |
| 2019 | 52 |
| 2020 | 40 |
| 2021 | 50 |
| 2022 | 49 |
| 2023 | 38 |
| 2024 | 31 |
| 2025 | 24 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication
US-2024092946-A1 · Mar 21, 2024 · US
Polycarbonate resin molding material
US-2017298176-A1 · Oct 19, 2017 · US
Metal complex and color conversion film comprising same
US-2017260212-A1 · Sep 14, 2017 · US
Composition, method of manufacturing composition, curable composition, cured film, near-infrared cut filter, solid-state imaging device, infrared sensor, and camera module
US-2017174869-A1 · Jun 22, 2017 · US
Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition
US-9633921-B2 · Apr 25, 2017 · US
Method of forming polyaryl polymers and polymers formed thereby
US-2017051102-A1 · Feb 23, 2017 · US
Polymer compositions comprising cross-linked polymers comprising boronic ester functions enabling exchange reactions, process for preparing them and their use
US-2017051144-A1 · Feb 23, 2017 · US
Method of forming polyaryl polymers and polymers formed thereby
US-9574046-B1 · Feb 21, 2017 · US
Viscoelastic silicon rubber compositions
US-9550864-B2 · Jan 24, 2017 · US
Photopolymerizable liquid composition
US-2017014544-A1 · Jan 19, 2017 · US
Adhesive composition containing ionic antistatic agent
US-2017015878-A1 · Jan 19, 2017 · US
Resin - fluorine-containing boric acid composite particles composite material
US-2017015840-A1 · Jan 19, 2017 · US
Siloxane compound and process for producing the same
US-9518073-B2 · Dec 13, 2016 · US
Dual-pack adhesive and structural piece containing same
US-2016347975-A1 · Dec 1, 2016 · US
Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition
US-2016336246-A1 · Nov 17, 2016 · US
Polymeric film composition for non-enzymatic glucose sensor and non-enzymatic glucose sensor including the same
US-9493652-B2 · Nov 15, 2016 · US
Organic electronic material, ink composition, and organic electronic element
US-9496509-B2 · Nov 15, 2016 · US
Polycarbonate resin molding material
US-2016297924-A1 · Oct 13, 2016 · US
Resin composition containing ethylene-vinyl alcohol copolymer
US-9453094-B2 · Sep 27, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08K5/55?
- CPC C08K5/55 is the Cooperative Patent Classification code for “Boron-containing compounds {(C08K5/0091 takes precedence)}.”
- How many patents are filed under CPC C08K5/55 (Boron-containing compounds {(C08K5/0091 takes precedence)})?
- Our database includes 415 publications tagged with this CPC code.
- Is patent activity under CPC C08K5/55 growing?
- Publication counts under this code: 31 in 2024 vs 24 in 2025 (latest complete years).