by surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232)

by surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232) · Cooperative Patent Classification (CPC)

Chemical and metallurgical processes, compounds, and materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeC08J9/24
Official titleby surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232)
Display labelby surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232)
Total patents89

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20165
20178
20189
20196
202013
202112
202210
20239
202413
20254

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC C08J9/24?
CPC C08J9/24 is the Cooperative Patent Classification code for “by surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232).”
How many patents are filed under CPC C08J9/24 (by surface fusion and bonding of particles to form voids, e.g. sintering (of expandable particles C08J9/232))?
Our database includes 89 publications tagged with this CPC code.
Is patent activity under CPC C08J9/24 growing?
Publication counts under this code: 13 in 2024 vs 4 in 2025 (latest complete years).