Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern

US2021165327A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021165327-A1
Application numberUS-201917268038-A
CountryUS
Kind codeA1
Filing dateAug 8, 2019
Priority dateAug 20, 2018
Publication dateJun 3, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising:a compound having a group of formula (0A):(In formula (0A),RA is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; andRB is an alkyl group having 1 to 4 carbon atoms.); anda compound having a group of formula (0B):

First claim

Opening claim text (preview).

1 . A film forming material for lithography comprising: a compound having a group of formula (0A): wherein R A is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R B is an alkyl group having 1 to 4 carbon atoms; and a compound having a group of formula (0B): 2 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0A) has two or more groups of formula (0A). 3 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0B) has two or more groups of formula (0B). 4 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0A) is a compound having two groups of formula (0A) or an addition polymerization resin of a compound having a group of formula (0A). 5 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0B) is a compound having two groups of formula (0B) or an addition polymerization resin of a compound having a group of formula (0B). 6 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0A) is represented by formula (1A 0 ): wherein R A and R B are as defined above; and Z is a divalent hydrocarbon group having 1 to 100 carbon atoms and optionally containing a heteroatom. 7 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0A) is represented by formula (1A): wherein R A and R B are as defined above; each X is independently a single bond, —O—, —CH 2 —, —C(CH 3 ) 2 —, —CO—, —C(CF 3 ) 2 —, —CONH—, or —COO—; A is a single bond, an oxygen atom, or a divalent hydrocarbon group having 1 to 80 carbon atoms and optionally containing a heteroatom; each R 1 is independently a group having 0 to 30 carbon atoms and optionally containing a heteroatom; and each m1 is independently an integer of 0 to 4. 8 . The film forming material for lithography according to claim 7 , wherein: A is a single bond, an oxygen atom, —(CH 2 ) p —, —CH 2 C(CH 3 ) 2 CH 2 —, —(C(CH 3 ) 2 ) p —, —(O(CH 2 ) q ) p —, —(O(C 6 H 4 )) p —, or any of the following structures: Y is a single bond, —O—, —CH 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, p is an integer of 0 to 20; and q is an integer of 0 to 4. 9 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0A) is represented by formula (2A): wherein R A and R B are as defined above; each R 2 is independently a group having 0 to 10 carbon atoms and optionally containing a heteroatom; each m2 is independently an integer of 0 to 3; each m2′ is independently an integer of 0 to 4; and n is an integer of 0 to 4. 10 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0A) is represented by formula (3A): wherein R A and R B are as defined above; R 3 and R 4 are each independently a group having 0 to 10 carbon atoms and optionally containing a heteroatom; each m3 is independently an integer of 0 to 4; each m4 is independently an integer of 0 to 4; and n is an integer of 0 to 4. 11 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0B) is represented by formula (1B 0 ): wherein Z is a divalent hydrocarbon group having 1 to 100 carbon atoms and optionally containing a heteroatom. 12 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0B) is represented by formula (1B): wherein each X is independently a single bond, —O—, —CH 2 —, —C(CH 3 ) 2 —, —CO—, —C(CF 3 ) 2 —, —CONH—, or —COO—; A is a single bond, an oxygen atom, or a divalent hydrocarbon group having 1 to 80 carbon atoms and optionally containing a heteroatom; each R 1 is independently a group having 0 to 30 carbon atoms and optionally containing a heteroatom; and each m1 is independently an integer of 0 to 4. 13 . The film forming material for lithography according to claim 12 , wherein: A is a single bond, an oxygen atom, —(CH 2 ) p —, —CH 2 C(CH 3 ) 2 CH 2 —, —(C(CH 3 ) 2 ) p —, —(O(CH 2 ) q ) p —, —(O(C 6 H 4 )) p —, or any of the following structures: Y is a single bond, —O—, —CH 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, p is an integer of 0 to 20; and each q is independently an integer of 0 to 4. 14 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0B) is represented by formula (2B): wherein each R 2 is independently a group having 0 to 10 carbon atoms and optionally containing a heteroatom; each m2 is independently an integer of 0 to 3; each m2′ is independently an integer of 0 to 4; and n is an integer of 0 to 4. 15 . The film forming material for lithography according to claim 1 , wherein the compound having a group of formula (0B) is represented by formula (3B): wherein R 3 and R 4 are each independently a group having 0 to 10 carbon atoms and optionally containing a heteroatom; each m3 is independently an integer of 0 to 4; each m4 is independently an integer of 0 to 4; and n is an integer of 0 to 4. 16 . The film forming material for lithography according to claim 1 , further comprising a crosslinking agent. 17 . The film forming material for lithography according to claim 16 , wherein the crosslinking agent is at least one selected from the group consisting of a phenol compound, an epoxy compound, a cyanate compound, an amino compound, a benzoxazine compound, a melamine compound, a guanamine compound, a glycoluril compound, a urea compound, an isocyanate compound, and an azide compound. 18 . The film forming material for lithography according to claim 16 , wherein the crosslinking agent has at least one allyl group. 19 . The film forming mater

Assignees

Inventors

Classifications

  • Processes for improving the resolution of the masks · CPC title

  • characterised by the processes involved to create the masks · CPC title

  • characterised by their behaviours during the lithography processes, e.g. soluble masks or redeposited masks · CPC title

  • Photolithographic processes · CPC title

  • characterised by their composition, e.g. multilayer masks · CPC title

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What does patent US2021165327A1 cover?
An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following…
Who is the assignee on this patent?
Mitsubishi Gas Chemical Co
What technology area does this patent fall under?
Primary CPC classification G03F7/11. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Jun 03 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).