Epoxy compound, composition, cured product and laminate

Patent metadata

Field	Value
Publication number	US-11760711-B2
Application number	US-201816772858-A
Country	US
Kind code	B2
Filing date	Nov 20, 2018
Priority date	Dec 18, 2017
Publication date	Sep 19, 2023
Grant date	Sep 19, 2023

Abstract

The invention provides an epoxy compound A represented by the following formula (1):

in the formula (1), Ar's each independently represent a structure having an unsubstituted or substituted aromatic ring; R 1 and R 2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; R 3 to R 8 represent a hydroxy group, a glycidyl ether group and/or a 2-methylglycidyl ether group, and at least one of R 3 to R 8 is a glycidyl ether group or a 2-methylglycidyl ether group; R 9 to R 12 represent a hydroxy group or a methyl group; n is an integer of 11 to 16; and m, p 1 , p 2 , and q are average values of repetition, m is 0.5 to 10, p 1 and p 2 are each independently 0 to 5, and q is 0.5 to 5 (provided that each repeating unit present in the repeating units may be the same or different).

First claim

The invention claimed is:

1. An epoxy compound A prepared by:
reacting a hydroxy compound B with an epihalohydrin (a3);
wherein the hydroxy compound B is formed by reacting a diglycidyl ether (a1) of an aliphatic dihydroxy compound and an aromatic hydroxy compound (a2) at a molar ratio (a1)/(a2) in the range of 1/1.01 to 1/5.0;
wherein the aliphatic dihydroxy compound is represented by the following structure:

where R 1 and R 2 each independently represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms, and n is an integer of 11 to 16;
wherein the aromatic hydroxy compound (a2) is represented by the following structure:
HO—Ar—OH

where Ar is an unsubstituted or substituted aromatic structure; and
wherein the hydroxy compound B is represented by the following structure:

where R 6 and R 7 each represent a hydroxyl group, R 10 and R 11 each independently represent a hydrogen atom or a methyl group, and m is an average value of repetition and is 0.5 to 10.

2. The epoxy compound A according to claim 1 , wherein both terminal OH groups of the hydroxy compound B have been reacted to form terminal glycidyl ether groups.

3. The epoxy compound A according to claim 2 , wherein Ar is any aromatic structure represented by the following formula (2):

in the formula (2), the aromatic structure may be substituted or unsubstituted, and * represents a bonding point.

4. The epoxy compound A according to claim 2 , wherein Ar is an aromatic structure substituted by a hydroxyl group.

5. A composition comprising the epoxy compound A according to claim 2 .

6. The epoxy compound A according to claim 1 , wherein Ar is any aromatic structure represented by the following formula (2):

in the formula (2), the aromatic structure may be substituted or unsubstituted, and * represents a bonding point.

7. The epoxy compound A according to claim 6 , wherein Ar is an aromatic structure substituted by a hydroxyl group.

8. A composition comprising the epoxy compound A according to claim 6 .

9. The epoxy compound A according to claim 1 , wherein Ar is an aromatic structure substituted by a hydroxyl group.

10. A composition comprising the epoxy compound A according to claim 9 .

11. A composition comprising the epoxy compound A according to claim 1 .

12. A composition comprising the epoxy compound A according to claim 1 and a curing agent.

13. The composition according to claim 12 , wherein the curing agent is at least one selected from an amine compound, a phenol compound, a carboxylic acid compound, and an acid anhydride compound.

14. The composition according to claim 12 , further comprising a filler.

15. A cured product obtained by curing the composition according to claim 12 .

16. A laminate comprising a substrate and a layer of the cured product according to claim 15 .

17. The laminate according to claim 16 , wherein the substrate is a metal or a metal oxide.

18. An electronic member comprising the laminate according to claim 16 .

19. A laminate comprising a substrate, a second substrate, and a layer of the cured product according to claim 15 , wherein the laminate is formed by laminating the substrate, the layer of the cured product, and the second substrate in this order, wherein the substrate is a metal or a metal oxide, and the second substrate is a plastic layer.

20. An adhesive for a metal or a metal oxide, comprising the epoxy compound A according to claim 1 and at least one of a curing agent and a curing accelerator.

21. A composition comprising the epoxy compound A according to claim 1 and a curing accelerator.

22. A cured product obtained by curing the composition according to claim 21 .

23. A composition comprising the epoxy compound A according to claim 1 , a curing agent, and a curing accelerator.

24. A cured product obtained by curing the composition according to claim 23 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• Arita Kazuo
• Otsu Masato
• Suzuki Etsuko

Classifications

• C08G59/063 Primary

  with epihalohydrins · CPC title

• C07D303/26 Primary

  having one or more free hydroxyl radicals · CPC title

• C07C43/23 Primary

  containing hydroxy or O-metal groups · CPC title

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/245

  aromatic · CPC title