Polyolefin resin composition
US-2017342207-A1 · Nov 30, 2017 · US
Di-epoxy compounds
Di-epoxy compounds · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/22 |
| Official title | Di-epoxy compounds |
| Display label | Di-epoxy compounds |
| Total patents | 300 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 26 |
| 2016 | 23 |
| 2017 | 22 |
| 2018 | 23 |
| 2019 | 29 |
| 2020 | 38 |
| 2021 | 34 |
| 2022 | 36 |
| 2023 | 19 |
| 2024 | 22 |
| 2025 | 26 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Monomer, hardmask composition comprising monomer, and pattern forming method using hardmask composition
US-9823566-B2 · Nov 21, 2017 · US
Interlayer filler composition for semiconductor device and method for producing semiconductor device
US-2017287866-A1 · Oct 5, 2017 · US
Impregnating Resin, Conductor Arrangement, Electrical Coil and Electrical Machine
US-2017240693-A1 · Aug 24, 2017 · US
Fresnel lens and optical device provided with same
US-2017227190-A1 · Aug 10, 2017 · US
Reaction products of amino acids and epoxies
US-2017218533-A1 · Aug 3, 2017 · US
Liquid epoxy resin composition
US-2017174879-A1 · Jun 22, 2017 · US
High heat monomers and methods of use thereof
US-2017158806-A1 · Jun 8, 2017 · US
Polycarboxylate ethers used as dispersing agents for epoxy resins
US-9617410-B2 · Apr 11, 2017 · US
Oxazolidone ring containing adducts
US-2017015778-A1 · Jan 19, 2017 · US
Aromatic dispersant composition
US-9540486-B2 · Jan 10, 2017 · US
Photocurable epoxy resin systems
US-2016376435-A1 · Dec 29, 2016 · US
Adhesive having water vapour barrier properties comprising incipiently polymerized epoxy syrup
US-2016355712-A1 · Dec 8, 2016 · US
Resin composition, and printed circuit board using same
US-9504147-B2 · Nov 22, 2016 · US
Curable composition
US-2016333135-A1 · Nov 17, 2016 · US
Antifriction coating
US-2016319211-A1 · Nov 3, 2016 · US
Transferrable Shadow Cure Method
US-2016318065-A1 · Nov 3, 2016 · US
Oxazolidone ring containing adducts
US-9481757-B2 · Nov 1, 2016 · US
Epoxy resin composition, and printed circuit board using same
US-9468096-B2 · Oct 11, 2016 · US
Epoxy resin compound and radiant heat circuit board using the same
US-9451695-B2 · Sep 20, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/22?
- CPC C08G59/22 is the Cooperative Patent Classification code for “Di-epoxy compounds.”
- How many patents are filed under CPC C08G59/22 (Di-epoxy compounds)?
- Our database includes 300 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/22 growing?
- Publication counts under this code: 22 in 2024 vs 26 in 2025 (latest complete years).