Resin composition, and printed circuit board using same

Patent metadata

Field	Value
Publication number	US-9504147-B2
Application number	US-201314651771-A
Country	US
Kind code	B2
Filing date	Dec 6, 2013
Priority date	Dec 12, 2012
Publication date	Nov 22, 2016
Grant date	Nov 22, 2016

Abstract

According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al 2 O 3 ) groups classified by particle size.

First claim

The invention claimed is:

1. A resin composition comprising:
a resin comprising an epoxy compound represented by the following Formula 1;
a curing agent comprising diaminodiphenylsulfone; and
an inorganic filler:

wherein each of R 1 to R 14 is independently selected from the group consisting of H, Cl, Br, F, a C 1 -C 3 alkyl, a C 2 -C 3 alkene, and a C 2 -C 3 alkyne, and each of m and n is 1, 2 or 3,
wherein the inorganic filler includes at least three alumina (Al 2 O 3 ) groups classified according to a particle size, a first alumina group having a particle size of 0.1 μm or more and less than 10 μm a second alumina group having a article size of 10 μm or more and less than 30 μm, and a third alumina group having a particle size of 30 μm or more and 60 μm or less, and
wherein a content ratio of the first alumina group and the second alumina group is in a range of 1:1 to 2, and a content ratio of the first alumina group and the third alumina group is in a range of 1:1.5 to 5.5.

2. The resin composition of claim 1 , wherein the resin comprises an epoxy compound represented by the following Formula 2:

3. The resin composition of claim 1 , wherein each of m and n is 2 or 3.

4. The resin composition of claim 3 , wherein each of m and n is 3.

5. The resin composition of claim 1 , wherein the first alumina group is included at a content of 10 to 66.5% by weight, based on the total weight of the resin composition, the second alumina group is included at a content of 10 to 66.5% by weight, based on the total weight of the resin composition, and the third alumina group is included at a content of 20 to 76.5% by weight, based on the total weight of the resin composition.

6. The resin composition of claim 5 , wherein the third alumina group is included at a content of 30 to 70% by weight, based on the total weight of the resin composition.

7. The resin composition of claim 6 , wherein the third alumina group is included at a content of 40 to 65% by weight, based on the total weight of the resin composition.

8. The resin composition of claim 1 , wherein the particle size of the first alumina group is 0.5 μm to 5 μm, the particle size of the second alumina group is 15 μm to 25 μm, and the particle size of the third alumina group is 30 μm to 45 μm.

9. The resin composition of claim 1 , wherein the epoxy compound of Formula 1, the curing agent, and the inorganic filler are included at contents of 3 to 40% by weight, 0.5 to 30% by weight, and 40 to 96.5% by weight, respectively, based on the total weight of the resin composition.

10. The resin composition of claim 1 , further comprising at least one of phenoxy and hyperbranched polyester.

11. A printed circuit board comprising:
a metal plate,
an insulating layer formed on the metal plate; and
a circuit pattern formed on the insulating layer,
wherein the insulating layer is made of the resin composition defined in claim 1 .

12. The printed circuit board of claim 11 , wherein each of m and n is 2 or 3.

13. The printed circuit board of claim 12 , wherein each of m and n is 3.

Assignees

• Lg Innotek Co Ltd

Inventors

• Yoon Yeo Eun
• Kim Myeong Jeong
• Yun Sungjin
• Ju Sanga

Classifications

• C08K2003/2227

  of aluminium · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C08K3/22

  of metals · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K1/053

  the metal substrate being covered by an inorganic insulating layer · CPC title