Epoxy resin system

US10414857B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10414857-B2
Application numberUS-201515111862-A
CountryUS
Kind codeB2
Filing dateMar 17, 2015
Priority dateMar 18, 2014
Publication dateSep 17, 2019
Grant dateSep 17, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curable resin system, comprising 1) an epoxy component comprising at least 60 wt.-% of polyglycidyl ethers of a polyphenol having an epoxy equivalent weight of up to about 190, based on the weight of the epoxy component; 2) a hardener component comprising a) a polyethylene tetraamine mixture in which linear triethylene tetraamine constitutes at least 60% of the total weight of the polyethylene tetraamine mixture, b) 0.05 to 0.2 moles of 1,4-diazabicyclo[2,2,2]octane per mole of primary and/or secondary amine compounds in the hardener component and c) no more than 5% by weight, based on the weight of the hardener component, of one or more other hardeners; wherein the epoxy component has a viscosity of 4000 to 6000 mPas at 25° C. 2. The curable resin system of claim 1 , wherein the polyglycidyl ethers of a polyphenol comprises no more than 1 wt. %, based on total weight of the polyglycidyl ethers of a polyphenol, of mono hydrolyzed resin content. 3. The curable resin system of claim 1 , wherein the weight ratio between the epoxy component and the hardener component is between 100:11 and 100:20. 4. The curable resin system of claim 1 , wherein the hardener component comprises over 90 wt. % of triethylenetetramine and the rest being 1,4-diazabicyclo[2,2,2]octane, based on the total weight of the hardener component. 5. The curable resin system of claim 1 further comprising an internal mold release agent. 6. A cured fiber-reinforced composite made from the resin system of claim 1 . 7. The curable resin system of claim 1 , which cures to a glass transition temperature of at least 120° C. when cured for 300 seconds at a curing temperature of 100 to 150° C. 8. The curable resin system of claim 1 , which cures to a glass transition temperature of at least 150° C. when cured for 180 seconds at a curing temperature of 100 to 150° C. 9. A curable resin system, comprising 1) an epoxy component consisting essentially of polyglycidyl ethers of a polyphenol having an epoxy equivalent weight of up to about 190 and having a mono hydrolyzed resin content of no more than 1 wt. %, based on total weight of the polyglycidyl ethers of a polyphenol, and optionally one or more optional ingredients selected from a solvent, reactive diluent, pigment, antioxidant, preservative, impact modifiers, reinforcing fibers having a length of up to 2 inches, non-fibrous particulate fillers and wetting agents; 2) a hardener component consisting essentially of a) a polyethylene tetraamine mixture in which linear triethylene tetraamine constitutes at least 60% of the total weight of the polyethylene tetraamine mixture, b) 0.05 to 0.2 moles of 1,4-diazabicyclo[2,2,2]octane per mole of primary and/or secondary amine compounds in the hardener component; wherein the epoxy component has a viscosity of 4000 to 6000 mPas at 25° C. 10. The curable resin system of claim 9 , which cures to a glass transition temperature of at least 120° C. when cured for 300 seconds at a curing temperature of 100 to 150° C. 11. The curable resin system of claim 9 , which cures to a glass transition temperature of at least 150° C. when cured for 180 seconds at a curing temperature of 100 to 150° C.

Assignees

Inventors

Classifications

  • aromatic · CPC title

  • Fibres or whiskers · CPC title

  • C08G59/502Primary

    Polyalkylene polyamines · CPC title

  • Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

  • Reinforcing macromolecular compounds with loose or coherent fibrous material · CPC title

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What does patent US10414857B2 cover?
A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
Who is the assignee on this patent?
Dow Global Technologies Llc
What technology area does this patent fall under?
Primary CPC classification C08G59/502. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).