Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-10465089-B2
Application number	US-201816124987-A
Country	US
Kind code	B2
Filing date	Sep 7, 2018
Priority date	Feb 24, 2009
Publication date	Nov 5, 2019
Grant date	Nov 5, 2019

Abstract

The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.

First claim

The invention claimed is:

1. A production method for producing a varnish, comprising reacting a compound having an amino group and a resin having a plurality of epoxy groups, and having at least one polycyclic structure selected from the group consisting of a structure formed through condensation of aromatic rings, a biphenyl novolak structure, or a terphenyl structure, wherein a portion of the plurality of the epoxy groups of the resin is caused to react with the amino group of the compound in an organic solvent, to form a reaction product having a weight average molecular weight in the range of 800 to 4000.

2. The production method according to claim 1 , further comprising reacting a compound having a phenolic hydroxyl group and the resin, wherein another portion of the plurality of the epoxy groups of the resin is caused to react with the phenolic hydroxyl group of the compound in the organic solvent.

3. The production method according to claim 2 , wherein the compound having a phenolic hydroxyl group is a phenol novolak resin or a cresol novolak resin.

4. The production method according to claim 1 , wherein the compound having an amino group is any of guanamine, dicyandiamide, and aminotriazine novolak.

5. The production method according to claim 1 , wherein the resin has at least one structure selected from the group consisting of a naphthalene structure, the biphenyl novolak structure, an anthracene structure, and a dihydroanthracene structure.

6. The production method according to claim 1 , the varnish containing a resin component having a structure represented by the following formula (1):

wherein R 1 represents the residue of a compound having an amino group.

7. The production method according to claim 6 , wherein the ratio of the molar fraction of the structure represented by formula (1) to the sum of the molar fraction of the structure represented by formula (1) and that of a structure represented by the following formula (2):

is 40% or less.

8. A prepreg produced by applying, to a substrate, a varnish produced by the production method as recited in claim 6 , and drying the resultant product under heating.

9. A resin-coated film produced by applying, to a film, a varnish produced by the production method as recited in claim 6 , and drying the resultant product under heating.

10. A prepreg produced by applying, to a substrate, a varnish produced by the production method as recited in claim 1 , and drying the resultant product under heating.

11. A prepreg according to claim 10 , wherein the substrate is a glass woven fabric, a glass nonwoven fabric, an aramid woven fabric, or an aramid nonwoven fabric.

12. A metal-foil-clad laminate comprising a prepreg as recited in claim 10 and a conductor layer provided on at least one surface of the prepreg.

13. A printed wiring board produced by forming a wiring pattern on the conductor layer provided on at least one surface of a metal-foil-clad laminate as recited in claim 12 .

14. A resin-coated film produced by applying, to a film, a varnish produced by the production method as recited in claim 1 , and drying the resultant product under heating.

15. A metal-foil-clad laminate comprising a resin-coated film as recited in claim 14 , and a conductor layer provided on at least one surface of the film.

16. The production method according to claim 1 , wherein the resin has at least one structure selected from the group consisting of the biphenyl novolak structure, a naphthalene structure, a naphthalene novolak structure, an anthracene structure, and a dihydroanthracene structure.

17. A production method for producing a varnish, comprising reacting a compound having a phenolic hydroxyl group and a resin having a plurality of epoxy groups, and having at least one polycyclic structure selected from the group consisting of a structure formed through condensation of aromatic rings, a biphenyl novolak structure, or a terphenyl structure, wherein a portion of the plurality of the epoxy groups of the resin is caused to react with the phenolic hydroxyl group of the compound in an organic solvent to form a reaction product having a weight average molecular weight in the range of 800 to 4000.

18. The production method according to claim 17 , wherein the compound having a phenolic hydroxyl group is a phenol novolak resin or a cresol novolak resin.

19. The production method according to claim 17 , wherein the resin has at least one structure selected from the group consisting of a naphthalene structure, the biphenyl novolak structure, an anthracene structure, and a dihydroanthracene structure.

20. A prepreg produced by applying, to a substrate, a varnish produced by the production method as recited in claim 17 , and drying the resultant product under heating.

21. A resin-coated film produced by applying, to a film, a varnish produced by the production method as recited in claim 17 , and drying the resultant product under heating.

22. The production method according to claim 17 , wherein the resin has at least one structure selected from the group consisting of the biphenyl novolak structure, a naphthalene structure, a naphthalene novolak structure, an anthracene structure, and a dihydroanthracene structure.

Assignees

• Hitachi Chemical Co Ltd

Inventors

• Morita Kouji
• Murai Hikari
• Takanezawa Shin
• Inoue Yasuo
• Sakai Kazunaga

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/69

  Insulating materials thereof · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2255/02

  on fibrous or filamentary layer · CPC title