Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
US-12534559-B2 · Jan 27, 2026 · US
Chemically modified polycondensates
Chemically modified polycondensates · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G14/12 |
| Official title | Chemically modified polycondensates |
| Display label | Chemically modified polycondensates |
| Total patents | 43 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 8 |
| 2017 | 9 |
| 2018 | 7 |
| 2019 | 4 |
| 2020 | 1 |
| 2021 | 1 |
| 2022 | 2 |
| 2023 | 1 |
| 2024 | 2 |
| 2025 | 4 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Urea-glyoxal crosslinking compounds for phenolic binder compositions
US-2025257192-A1 · Aug 14, 2025 · US
Urea-glyoxal crosslinking compounds for phenolic binder compositions
US-12325786-B2 · Jun 10, 2025 · US
Fluoropolymer adhesives and methods thereof
US-12275820-B2 · Apr 15, 2025 · US
Resin, method for producing resin, curable resin composition, and cured product
US-2025002632-A1 · Jan 2, 2025 · US
Urea-glyoxal crosslinking compounds for phenolic binder compositions
US-2024182684-A1 · Jun 6, 2024 · US
Urea-glyoxal crosslinking compounds for phenolic binder compositions
US-11905392-B2 · Feb 20, 2024 · US
Fluoropolymer adhesives and methods thereof
US-2023002557-A1 · Jan 5, 2023 · US
Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
US-2022380508-A1 · Dec 1, 2022 · US
Fluoropolymer adhesives and methods thereof
US-11421080-B2 · Aug 23, 2022 · US
Urea-glyoxal crosslinking compounds for phenolic binder compositions
US-2021054171-A1 · Feb 25, 2021 · US
Fluoropolymer adhesives and methods thereof
US-2020199299-A1 · Jun 25, 2020 · US
Novolac curing agent with alkoxysilyl group, method for preparing the same, composition containing the same, the cured product, and use thereof
US-10519274-B2 · Dec 31, 2019 · US
Heat-curable resin composition for semiconductor encapsulation
US-10385203-B2 · Aug 20, 2019 · US
Cyanate ester compound, curable resin composition containing the compound, and hardened product thereof
US-10370325-B2 · Aug 6, 2019 · US
Cyanic acid ester compound and method for producing same, resin composition, and cured product
US-10174149-B2 · Jan 8, 2019 · US
Cyanate ester compound, curable resin composition containing said compound, and cured product of said composition
US-10160824-B2 · Dec 25, 2018 · US
Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition
US-10155835-B2 · Dec 18, 2018 · US
Polyphenolic condensates and epoxy resins thereof
US-10138325-B2 · Nov 27, 2018 · US
Cyanate ester compound, curable resin composition containing the compound, and hardened product thereof
US-2018105488-A1 · Apr 19, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G14/12?
- CPC C08G14/12 is the Cooperative Patent Classification code for “Chemically modified polycondensates.”
- How many patents are filed under CPC C08G14/12 (Chemically modified polycondensates)?
- Our database includes 43 publications tagged with this CPC code.
- Is patent activity under CPC C08G14/12 growing?
- Publication counts under this code: 2 in 2024 vs 4 in 2025 (latest complete years).