Heat-curable resin composition for semiconductor encapsulation

Patent metadata

Field	Value
Publication number	US-10385203-B2
Application number	US-201715691189-A
Country	US
Kind code	B2
Filing date	Aug 30, 2017
Priority date	Sep 1, 2016
Publication date	Aug 20, 2019
Grant date	Aug 20, 2019

Abstract

Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer.
The heat-curable resin composition for semiconductor encapsulation comprises:
(A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa·s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.

First claim

What is claimed is:

1. A heat-curable resin composition for semiconductor encapsulation, comprising:
(A) a cyanate ester compound having not less than two cyanato groups in one molecule, the cyanate ester compound containing a cyanate ester compound (A-1) represented by the following formula (1) and exhibiting a viscosity of not higher than 50 Pa·s at 23° C. when measured by a B-type rotary viscometer in accordance with a method described in JIS K7117-1:1999

wherein n represents an integer of 0 or 1; each of R 1 and R 2 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R 3 represents a divalent linking group selected from the groups expressed by the following formulae (2) to (5)

(B) a phenol curing agent containing a resorcinol-type phenolic resin represented by the following formula (6)

wherein n represents an integer of 0 to 10; each of R 1 and R 2 independently represents a hydrogen atom or a monovalent group selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an allyl group and a vinyl group; and x represents 1 or 2;
(C) a curing accelerator in an amount of 0.01 to 5 parts by mass per 100 parts by mass of the component (A);
(D) an inorganic filler that is spherical, has an average particle diameter of 1 to 20 μm when measured by a laser diffraction method, is in an amount of 1,200 to 2,200 parts by mass per 100 parts by mass of a sum total of the components (A) and (B), and has been surface-treated with a silane coupling agent represented by the following formula (7)
R 1 a (OR 2 ) (3-a) Si—C 3 H 6 —R 3   (7)

wherein a represents an integer of 0 to 3; R 1 represents a methyl group or an ethyl group; R 2 represents an alkyl group having 1 to 3 carbon atoms; and R 3 represents a group selected from the group consisting of the nitrogen-containing functional groups represented by the following formulae (8) to (11)

and
(E) an ester compound that is in an amount of 1 to 10 parts by mass per 100 parts by mass of the sum total of the components (A) and (B), and is represented by the following formula (12)
R 4 —CH 2 CH 2 —NH—CH 2 CH 2 —R 5   (12)

wherein each of R 4 and R 5 represents a saturated ester residue having 2 to 30 carbon atoms.

2. The heat-curable resin composition for semiconductor encapsulation according to claim 1 , wherein cyanate ester compound content in the component (A) except for the cyanate ester compound (A-1) represented by the formula (1) is an amount of smaller than 10% by mass with respect to the whole amount of the component (A).

3. The heat-curable resin composition for semiconductor encapsulation according to claim 1 , wherein the resorcinol-type phenolic resin represented by the formula (6) is contained in the component (B) by an amount of 10 to 100% by mass with respect to the whole amount of the component (B).

4. The heat-curable resin composition for semiconductor encapsulation according to claim 1 , wherein cyanato groups in the cyanate ester compound as the component (A) are in an amount of 0.5 to 100 equivalents per 1 equivalent of hydroxyl groups in the phenol curing agent as the component (B).

5. The heat-curable resin composition for semiconductor encapsulation according to claim 1 , exhibiting a linear expansion coefficient of 3.0 to 5.0 ppm/° C. as a result of measuring a 5×5×15 mm specimen at a rate of temperature increase of 5° C./min and under a load of 19.6 mN, in accordance with a method described in JIS K 7197:2012.

6. A method for producing a resin-encapsulated semiconductor device, comprising:
a step of using a cured product of the heat-curable resin composition for semiconductor encapsulation as set forth in claim 1 to collectively encapsulate an entire silicon wafer or substrate with at least one semiconductor element mounted thereon, wherein
the heat-curable resin composition for semiconductor encapsulation is applied either in a pressurized manner, or in a depressurized manner under a vacuum atmosphere, before being heated and cured to encapsulate the semiconductor element.

Assignees

• Shinetsu Chemical Co

Inventors

• Sumita Kazuaki
• Nakamura Tomoaki
• Kushihara Naoyuki

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/473

  containing a filler · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title