Cyanic acid ester compound and method for producing same, resin composition, and cured product

Patent metadata

Field	Value
Publication number	US-10174149-B2
Application number	US-201515519306-A
Country	US
Kind code	B2
Filing date	Nov 24, 2015
Priority date	Dec 18, 2014
Publication date	Jan 8, 2019
Grant date	Jan 8, 2019

Abstract

The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1):

wherein n represents an integer of 1 or larger.

First claim

The invention claimed is:

1. A resin composition comprising a cyanic acid ester compound (A) and 2,2-bis(4-cyanatophenyl)propane, the cyanic acid ester compound (A) having a structure represented by the following formula (1):

wherein n represents an integer of 1 or larger.

2. The resin composition according to claim 1 , wherein the cyanic acid ester compound has a weight-average molecular weight Mw of 100 to 5000.

3. The resin composition according to claim 1 , further comprising one or more components selected from the group consisting of a maleimide compound (C), a phenol resin (D), an epoxy resin (E), an oxetane resin (F), a benzoxazine compound (G), and a compound (H) having a polymerizable unsaturated group.

4. The resin composition according to claim 3 , comprising an epoxy resin (E), wherein the epoxy resin (E) comprises one or more resins selected from the group consisting of a biphenyl aralkyl-based epoxy resin, a naphthylene ether-based epoxy resin, a polyfunctional phenol-based epoxy resin, and a naphthalene-based epoxy resin.

5. The resin composition according to claim 1 , wherein a content of the cyanic acid ester compound (A) is 1 to 90 parts by mass with respect to 100 parts by mass of resin solids in the resin composition.

6. The resin composition according to claim 1 , further comprising a filler (I).

7. The resin composition according to claim 6 , wherein a content of the filler (I) is 50 to 1600 parts by mass with respect to 100 parts by mass of resin solids in the resin composition.

8. A cured product obtained by curing the resin composition according to claim 1 .

9. A prepreg comprising
a base material, and
the resin composition according to claim 1 with which the base material is impregnated or coated.

10. A metal foil-clad laminate comprising one or more layers of the prepreg according to claim 9 , and a metal foil disposed on one side or both sides of the prepreg.

11. A resin sheet comprising
a support, and
a layer comprising the resin composition according to claim 1 disposed on a surface of the support.

12. A printed circuit board comprising an insulating layer comprising the resin composition according to claim 1 , and a conductor layer disposed on a surface of the insulating layer.

13. A material for encapsulation comprising the resin composition according to claim 1 .

14. A fiber-reinforced composite material comprising the resin composition according to claim 1 .

15. An adhesive comprising the resin composition according to claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Kobayashi Takashi
• Takano Kentaro
• Katagiri Masayuki
• Tokuzumi Keita
• Shima Tatsuya

Classifications

• C09J165/04

  Polyxylylenes · CPC title

• C09J11/06

  organic · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• C09J11/08

  Macromolecular additives · CPC title

• C09J161/34

  Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20 · CPC title