Bioactive peptide brush polymers via photoinduced reversible-deactivation radical polymerization
US-12516145-B2 · Jan 6, 2026 · US
from polycondensates with side or terminal unsaturations
from polycondensates with side or terminal unsaturations · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F299/022 |
| Official title | {from polycondensates with side or terminal unsaturations} |
| Display label | from polycondensates with side or terminal unsaturations |
| Total patents | 57 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 3 |
| 2018 | 3 |
| 2019 | 6 |
| 2020 | 7 |
| 2021 | 7 |
| 2022 | 6 |
| 2023 | 4 |
| 2024 | 4 |
| 2025 | 14 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
US-2025346761-A1 · Nov 13, 2025 · US
Copolymer, elastomer spherical particles, liquid dispersion of elastomer spherical particles, and methods for producing these
US-2025346711-A1 · Nov 13, 2025 · US
Polymerizable composition for optical material, molded product, optical material, and plastic lens and method for manufacturing same
US-12448470-B2 · Oct 21, 2025 · US
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board
US-12428534-B2 · Sep 30, 2025 · US
Resin composition, method for producing same, and cured product of resin composition
US-2025277077-A1 · Sep 4, 2025 · US
Bismaleimide compound, resin composition including same, cured object therefrom, semiconductor element and dry film resist
US-2025270372-A1 · Aug 28, 2025 · US
Amine containing polymer compositions and uses thereof
US-2025250379-A1 · Aug 7, 2025 · US
Resin, resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
US-2025188207-A1 · Jun 12, 2025 · US
Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
US-2025188256-A1 · Jun 12, 2025 · US
Resin composition, and curable film and laminated plate containing same
US-2025129243-A1 · Apr 24, 2025 · US
Resin composition and production method therefor, and cured product of resin composition
US-2025101181-A1 · Mar 27, 2025 · US
Cross-linkable fluoropolymer
US-2025051498-A1 · Feb 13, 2025 · US
Curable composition
US-2025034429-A1 · Jan 30, 2025 · US
Thermosetting resin composition, resin composition for printed wiring board, and resin composition for printed wiring board substrate
US-2025034385-A1 · Jan 30, 2025 · US
Composition comprising maleimide pre-polymerized resin
US-12122912-B2 · Oct 22, 2024 · US
Tandem repeat protein sequences in protein-like polymers and uses thereof
US-2024327473-A1 · Oct 3, 2024 · US
Electrolyte composition, electrolyte film, and method of manufacturing electrolyte film
US-12027666-B2 · Jul 2, 2024 · US
Curable compound product
US-2024026076-A1 · Jan 25, 2024 · US
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device
US-2023250233-A1 · Aug 10, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08F299/022?
- CPC C08F299/022 is the Cooperative Patent Classification code for “from polycondensates with side or terminal unsaturations.”
- How many patents are filed under CPC C08F299/022 (from polycondensates with side or terminal unsaturations)?
- Our database includes 57 publications tagged with this CPC code.
- Is patent activity under CPC C08F299/022 growing?
- Publication counts under this code: 4 in 2024 vs 14 in 2025 (latest complete years).