Composition comprising maleimide pre-polymerized resin

Patent metadata

Field	Value
Publication number	US-12122912-B2
Application number	US-202117557846-A
Country	US
Kind code	B2
Filing date	Dec 21, 2021
Priority date	Nov 4, 2021
Publication date	Oct 22, 2024
Grant date	Oct 22, 2024

Abstract

The present invention provides a resin composition comprising maleimide-containing pre-polymerized resin and article made therefrom. The resin composition comprises: 100 weight parts of vinyl-containing polyphenylene ether resin; 35 to 45 weight parts of bis(vinylphenyl)ethane; and 30 to 60 weight parts of maleimide-containing pre-polymerized resin; wherein the maleimide-containing pre-polymerized resin is obtained by pre-polymerization of aromatic maleimide resin and long chain maleimide resin. The articles made from the resin composition improve at least one characteristic of glass transition temperature variation, copper foil peeling strength, percentage of thermal expansion, coefficient of thermal expansion and surface appearance.

First claim

What is claimed is:

1. A resin composition comprising maleimide-containing pre-polymerized resin comprising:
100 parts by weight of vinyl-containing polyphenylene ether resin;
35 to 45 parts by weight of bis(vinylphenyl) ethane; and
30 parts by weight to 60 parts by weight of maleimide pre-polymerized resin;
wherein the maleimide pre-polymerized resin is a prepolymer obtained by pre-polymerization of aromatic maleimide resin and long-chain maleimide resin, and wherein the long-chain maleimide resin comprises a structure shown in any one of formula (1) to formula (4);

wherein, in formula (1) and formula (2), n is an integer from 1 to 10 respectively; in formula (3), m1 is an integer from 1 to 5, and m2 is an integer from 1 to 5; in formula (4), n is an integer from 1 to 3; and
wherein the weight ratio of the aromatic maleimide resin to the long-chain maleimide resin is 1:3 to 1:5.

2. The resin composition comprising maleimide-containing pre-polymerized resin according to claim 1 , wherein the vinyl-containing polyphenylene ether resin comprises methacrylate-containing polyphenylene ether resin, vinylbenzyl-containing biphenyl polyphenylene ether resin, vinylbenzyl-containing bisphenol A polyphenylene ether resin, chain-extended vinyl-containing polyphenylene ether resin, or a combination thereof.

3. The resin composition comprising maleimide-containing pre-polymerized resin according to claim 1 , wherein the aromatic maleimide resin comprises bis (3-ethyl-5-methyl-4-maleimidephenyl) methane, bisphenol A diphenyl ether bismaleimide, polyphenylmethane maleimide and 4,4′-diphenylmethane bismaleimide, or a combination thereof.

4. The resin composition comprising maleimide-containing pre-polymerized resin according to claim 1 , further comprising flame retardant, crosslinking agent, inorganic filler, curing accelerator, solvent, polymerization inhibitor, silane coupling agent, coloring agent, toughening agent, core-shell rubber or a combination thereof.

5. An article of the resin composition comprising maleimide-containing pre-polymerized resin according to claim 1 , comprising: resin film, prepreg, laminate or printed circuit board.

6. The article of the resin composition comprising maleimide-containing pre-polymerized resin according to claim 5 , being measured with reference to the method described in IPC-TM-650 2.4.24.4, and its glass transition temperature variation being less than or equal to 3° C.

7. The article of the resin composition comprising maleimide-containing pre-polymerized resin according to claim 5 , being measured with reference to the method described in IPC-TM-650 2.4.8, and its copper foil peeling strength being greater than or equal to 3.2 lb/in.

8. The article of the resin composition comprising maleimide-containing pre-polymerized resin according to claim 5 , being measured with reference to the method described in IPC-TM-650 2.4.24.5, and its Z-axis percentage of thermal expansion being less than or equal to 2.5%.

9. The article of the resin composition comprising maleimide-containing pre-polymerized resin according to claim 5 , being measured with reference to the method described in IPC-TM-650 2.4.24.5, and its Z axis coefficient of thermal expansion being less than or equal to 45 ppm/° C.

Assignees

• Elite Material Co Ltd

Inventors

• Chang Shu-Hao

Classifications

• C08L79/085

  Unsaturated polyimide precursors · CPC title

• B32B2260/046

  Synthetic resin · CPC title

• B32B2260/021

  Fibrous or filamentary layer · CPC title

• B32B2262/101

  Glass fibres · CPC title

• C09J2400/163

  in the substrate · CPC title