Graft polyarylether copolymers
US-2026085142-A1 · Mar 26, 2026 · US
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on to unsaturated polyphenylene oxides
on to unsaturated polyphenylene oxides · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F283/085 |
| Official title | {on to unsaturated polyphenylene oxides} |
| Display label | on to unsaturated polyphenylene oxides |
| Total patents | 22 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2017 | 2 |
| 2018 | 3 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 3 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 2 |
| 2025 | 3 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition and article made therefrom
US-2026035559-A1 · Feb 5, 2026 · US
Resin composition and article made therefrom
US-2025361404-A1 · Nov 27, 2025 · US
Resin composition and article made therefrom
US-2025346701-A1 · Nov 13, 2025 · US
High heat deflection temperature ductile photopolymerizable material and additive manufacturing methods
US-2025333558-A1 · Oct 30, 2025 · US
Bifunctional sizing agent for improved adhesion to substrates
US-2024218123-A1 · Jul 4, 2024 · US
Polyphenylene ether resin composition, prepreg, metal-clad laminate
US-11939443-B2 · Mar 26, 2024 · US
Resin composition and article made therefrom
US-11840628-B2 · Dec 12, 2023 · US
Resin composition and article made therefrom
US-2023055543-A1 · Feb 23, 2023 · US
Polyphenylene ether resin composition, prepreg, metal-clad laminate
US-2022251376-A1 · Aug 11, 2022 · US
Encapsulation material, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor device
US-2022115285-A1 · Apr 14, 2022 · US
Resin composition and article made therefrom
US-11111383-B2 · Sep 7, 2021 · US
Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
US-11015052-B2 · May 25, 2021 · US
Resin composition and article made therefrom
US-2021108075-A1 · Apr 15, 2021 · US
Resin composition, prepreg, and copper clad laminate
US-10696783-B2 · Jun 30, 2020 · US
Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
US-2020181402-A1 · Jun 11, 2020 · US
Resin composition, prepreg, and copper clad laminate
US-2019194383-A1 · Jun 27, 2019 · US
Polyphenylene oxide prepolymer, method of making the same, resin composition and product made therefrom
US-10023672-B2 · Jul 17, 2018 · US
Phosphorus-containing vinyl polyphenylene ether, resin composition comprising phosphorus-containing vinyl polyphenylene ether and product thereof
US-10000599-B2 · Jun 19, 2018 · US
Phosphorus-containing vinyl polyphenylene ether, resin composition comprising phosphorus-containing vinyl polyphenylene ether and product thereof
US-2018086870-A1 · Mar 29, 2018 · US