Circuit material and circuit board containing the same
US-2021307164-A1 · Sep 30, 2021 · US
Polyphenylene ether resin composition, prepreg, metal-clad laminate
US11939443B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11939443-B2 |
| Application number | US-202017632067-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 7, 2020 |
| Priority date | Aug 6, 2019 |
| Publication date | Mar 26, 2024 |
| Grant date | Mar 26, 2024 |
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- Title
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Abstract
Official abstract text for this publication.
A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.
First claim
Opening claim text (preview).
The invention claimed is: 1. A polyphenylene ether resin composition comprising (A) polyphenylene ether, and (B) a styrene-butadiene-styrene block copolymer (SBS) having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure in a butadiene block of 80:20 to 100:0, wherein a number average molecular weight (Mn) of the component (A) is 1,000 to 5,000, and a weight average molecular weight (Mw) of the component (B) is 2,000 to 100,000. 2. The polyphenylene ether resin composition according to claim 1 , wherein a weight ratio of the styrene block to the butadiene block in the component (B) is 10:90 to 80:20. 3. The polyphenylene ether resin composition according to claim 1 , wherein a molecular weight distribution (Mw/Mn) of the component (B) is 1.00 to 3.00. 4. The polyphenylene ether resin composition according to claim 1 , wherein a content ratio of the component (A) to the component (B) is component (A): component (B)=5:95 to 95:5 in terms of weight ratio. 5. The polyphenylene ether resin composition according to claim 1 , further comprising a crosslinking agent. 6. The polyphenylene ether resin composition according to claim 5 , wherein a content of the crosslinking agent is 1 to 50% by weight with respect to a total weight of the component (A) and the component (B). 7. The polyphenylene ether resin composition according to claim 1 , further comprising a flame retardant. 8. The polyphenylene ether resin composition according to claim 7 , wherein a content of the flame retardant is 1 to 20% by weight with respect to a total weight of the component (A) and the component (B). 9. A prepreg wherein the polyphenylene ether resin composition according to claim 1 is impregnated in a base material. 10. A metal-clad laminate plate produced by laminating the prepreg according to claim 9 and a metal foil by hot press molding.
Assignees
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Classifications
- C08J5/244Primary
using glass fibres · CPC title
characterised by structural features of a {fibrous or filamentary} layer {(layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02)} · CPC title
Non-woven fabric · CPC title
of paper or cardboard · CPC title
next to a fibrous or filamentary layer · CPC title
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- What does patent US11939443B2 cover?
- A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the co…
- Who is the assignee on this patent?
- Nippon Soda Co
- What technology area does this patent fall under?
- Primary CPC classification C08J5/244. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).