Resin composition, prepreg, and copper clad laminate

Patent metadata

Field	Value
Publication number	US-10696783-B2
Application number	US-201715857403-A
Country	US
Kind code	B2
Filing date	Dec 28, 2017
Priority date	Dec 25, 2017
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.

First claim

What is claimed is:

1. A resin composition, comprising:
1.0 part by weight of (a) thermally conductive resin with a biphenyl group;
1.0 to 10.0 parts by weight of (b) polyphenylene oxide;
0.01 to 5.0 parts by weight of (c) hardener; and
0.1 to 3.0 parts by weight of (d) inorganic filler, wherein (d) inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide, and (d) inorganic filler is sheet-shaped or needle-shaped, wherein (a) thermally conductive resin with the biphenyl group has terminal alkylene groups, which has a chemical structure of:

wherein
R 1 is —CH 2 —, —C(═O)—, or —(CH 2 )—(C 6 H 4 )—: and
R 2 is H or CH 3 .

2. The resin composition as claimed in claim 1 , wherein (b) polyphenylene oxide has terminal alkylene groups, which has a chemical structure of:

wherein Ar is aromatic group,
each of R 3 is independently of H, CH 3 ,

R 4 is

m and n are positive integers, and
m+n=6˜300.

3. The resin composition as claimed in claim 1 , wherein (c) hardener comprises triallyl isocyanurate, trivinyl amine, triallyl cyanurate, or a combination thereof.

4. The resin composition as claimed in claim 1 , further comprising 0.001 to 0.05 parts by weight of (e) radical initiator.

5. The resin composition as claimed in claim 1 , further comprising 0.01% to 10.0% parts by weight of coupling agent.

6. The resin composition as claimed in claim 5 , wherein the coupling agent is added onto the surface of (d) inorganic filler.

7. A prepreg, being formed by magnetically aligning and curing a precursor, wherein the precursor is formed by impregnating a reinforcing material into the resin composition as claimed in claim 1 .

8. The prepreg as claimed in claim 7 , wherein the reinforcing material comprises glass, ceramic, carbon material, resin, or a combination thereof, and the reinforcing material has a manner of fiber, powder, flake, fabric, or a combination thereof.

9. A copper clad laminate, comprising:
the prepreg as claimed in claim 7 laminated to a copper foil.

10. A resin composition, comprising:
1.0 part by weight of (a) thermally conductive resin with a biphenyl group;
1.0 to 10.0 parts by weight of (b) polyphenylene oxide;
0.01 to 5.0 parts by weight of (c) hardener;
0.1 to 3.0 parts by weight of (d) inorganic filler; and
1.0 to 10.0 parts by weight of (f) compatibilizer,

wherein (d) inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide, and (d) inorganic filler is sheet-shaped or needle-shaped, wherein (a) thermally conductive resin with a biphenyl group has terminal epoxy groups, which has a chemical structure of:

wherein R 7 is —(CH 2 ) n —, and n=1˜3, and
R 8 is H or CH 3 ,
wherein (f) compatibilizer has a chemical structure of:

wherein R 5 is —CH 2 — or —C(CH 3 ) 2 —; and
R 6 is —(CH 2 ) n — and n=1˜3,
wherein (b) polyphenylene oxide has terminal alkylene groups, which has a chemical structure of:

wherein Ar is aromatic group,
each of R 3 is independently of H, CH 3 ,

R 4 is

m and n are positive integers, and
m+n=6˜300.

11. The resin composition as claimed in claim 10 , wherein (c) hardener includes (c1) triallyl isocyanurate, trivinyl amine, triallyl cyanurate, or a combination thereof and (c2) active ester, multi-amine compound, multi-alcohol compound, or a combination thereof.

12. The resin composition as claimed in claim 10 , further comprising 0.001 to 0.05 parts by weight of (e) radical initiator.

13. The resin composition as claimed in claim 10 , further comprising 0.01% to 10.0% parts by weight of coupling agent.

14. The resin composition as claimed in claim 13 , wherein the coupling agent is added onto the surface of (d) inorganic filler.

15. A prepreg, being formed by magnetically aligning and curing a precursor, wherein the precursor is formed by impregnating a reinforcing material into the resin composition as claimed in claim 10 .

16. The prepreg as claimed in claim 15 , wherein the reinforcing material comprises glass, ceramic, carbon material, resin, or a combination thereof, and the reinforcing material has a manner of fiber, powder, flake, fabric, or a combination thereof.

17. A copper clad laminate, comprising:
the prepreg as claimed in claim 15 laminated to a copper foil.

Assignees

• Iteq Corp
• Ind Tech Res Inst

Inventors

• Cheng Chen-Hsi
• Huang Ming-Hung

Classifications

• C08J5/247

  using fibres of at least two types · CPC title

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/244

  using glass fibres · CPC title

• C08J5/243

  using carbon fibres · CPC title

• B32B2264/02

  Synthetic macromolecular particles · CPC title