Resin composition, cured product of resin composition, semiconductor device, and electronic component
US-2026055225-A1 · Feb 26, 2026 · US
on to unsaturated polycarbonamides, polyesteramides or polyimides
on to unsaturated polycarbonamides, polyesteramides or polyimides · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F283/045 |
| Official title | {on to unsaturated polycarbonamides, polyesteramides or polyimides} |
| Display label | on to unsaturated polycarbonamides, polyesteramides or polyimides |
| Total patents | 34 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 1 |
| 2018 | 1 |
| 2019 | 4 |
| 2020 | 2 |
| 2021 | 5 |
| 2022 | 2 |
| 2023 | 1 |
| 2024 | 1 |
| 2025 | 11 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition and article made therefrom
US-2026035559-A1 · Feb 5, 2026 · US
Resin composition and article made therefrom
US-2025361404-A1 · Nov 27, 2025 · US
Resin composition for optical waveguides, resin composition for substrate with optical waveguide, resin film, cured object, and optical circuit board
US-2025326879-A1 · Oct 23, 2025 · US
Support body-equipped resin film, manufacturing method for printed wiring board, and manufacturing method for semiconductor package
US-2025326925-A1 · Oct 23, 2025 · US
Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package
US-2025326929-A1 · Oct 23, 2025 · US
Poly(amide-imide) copolymer, composition and polymer film comprising thereof
US-12404371-B2 · Sep 2, 2025 · US
Resin composition, resin film, printed wiring board, and semiconductor package
US-2025250430-A1 · Aug 7, 2025 · US
Polymer film-forming composition and selective polymer film-forming method
US-2025215256-A1 · Jul 3, 2025 · US
Resin composition, resin film, printed circuit board, and semiconductor package
US-2025174506-A1 · May 29, 2025 · US
Resin composition and article made therefrom
US-2025136739-A1 · May 1, 2025 · US
Resin composition and product made therefrom
US-2025129247-A1 · Apr 24, 2025 · US
Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device
US-2025059347-A1 · Feb 20, 2025 · US
Manufacturing method for bonded body, bonded body, manufacturing method for laminate, laminate, manufacturing method for device, and device, and composition for forming polyimide-containing precursor portion
US-2024339368-A1 · Oct 10, 2024 · US
Electrolyte for lithium secondary battery
US-11817557-B2 · Nov 14, 2023 · US
Maleimide resin film and composition for maleimide resin film
US-2022267526-A1 · Aug 25, 2022 · US
Photosensitive resin composition and cured film thereof
US-2022252979-A1 · Aug 11, 2022 · US
Liquid crystal display device
US-11112654-B2 · Sep 7, 2021 · US
Poly(amide-imide) copolymer, composition and polymer film comprising thereof
US-2021246265-A1 · Aug 12, 2021 · US
Polymers from muconic acid isomers and its derivatives
US-11059919-B2 · Jul 13, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08F283/045?
- CPC C08F283/045 is the Cooperative Patent Classification code for “on to unsaturated polycarbonamides, polyesteramides or polyimides.”
- How many patents are filed under CPC C08F283/045 (on to unsaturated polycarbonamides, polyesteramides or polyimides)?
- Our database includes 34 publications tagged with this CPC code.
- Is patent activity under CPC C08F283/045 growing?
- Publication counts under this code: 1 in 2024 vs 11 in 2025 (latest complete years).