Multi-layer body made of polycarbonate with high weathering resistance
US-9845412-B2 · Dec 19, 2017 · US
Resin composition, cured product of resin composition, semiconductor device, and electronic component
US2026055225A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2026055225-A1 |
| Application number | US-202319103122-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 28, 2023 |
| Priority date | Sep 2, 2022 |
| Publication date | Feb 26, 2026 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A resin composition that can cure at a relatively low temperature and has a long pot life, a cured product, and a semiconductor device and an electronic component including a cured product are provided. The resin composition includes (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor having sublimability. The resin composition further includes (D) electrically conductive particles as necessary.
First claim
Opening claim text (preview).
1 . A resin composition comprising: (A) a radically polymerizable curable resin; (B) an organic peroxide; and (C) a polymerization inhibitor having sublimability. 2 . The resin composition according to claim 1 , further comprising (D) electrically conductive particles. 3 . The resin composition according to claim 1 , wherein the organic peroxide (B) includes at least one member selected from the group consisting of dialkyl peroxides, peroxyesters, peroxymonocarbonates, diacyl peroxides, peroxydicarbonates, and peroxyketals. 4 . The resin composition according to claim 1 , wherein the organic peroxide (B) has a 10-hour half-life temperature of 70° C. or less. 5 . The resin composition according to claim 1 , wherein the radically polymerizable curable resin (A) contains a compound having a (meth)acryloyl group. 6 . The resin composition according to claim 1 , wherein the radically polymerizable curable resin (A) contains a bismaleimide compound. 7 . The resin composition according to claim 1 , wherein the polymerization inhibitor having sublimability (C) includes p-benzoquinone. 8 . A cured product obtained by curing the resin composition according to claim 1 . 9 . A cured product obtained by curing the resin composition according to claim 1 at 80° C. for 60 minutes, the cured product having a room temperature elastic modulus within a range of 0.005 GPa or more and 7.0 GPa or less. 10 . A semiconductor device comprising the cured product according to claim 9 . 11 . An electronic component comprising the cured product according to claim 9 .
Assignees
Inventors
Classifications
Metals · CPC title
Silver · CPC title
Conductive additives · CPC title
comprising polymers · CPC title
- C08K5/08Primary
Quinones · CPC title
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- What does patent US2026055225A1 cover?
- A resin composition that can cure at a relatively low temperature and has a long pot life, a cured product, and a semiconductor device and an electronic component including a cured product are provided. The resin composition includes (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor having sublimability. The resin composition further includ…
- Who is the assignee on this patent?
- Namics Corp
- What technology area does this patent fall under?
- Primary CPC classification C08K5/08. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Feb 26 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).