Curable composition
US-12545753-B2 · Feb 10, 2026 · US
Imides, e.g. cyclic imides
Imides, e.g. cyclic imides · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F122/40 |
| Official title | Imides, e.g. cyclic imides |
| Display label | Imides, e.g. cyclic imides |
| Total patents | 35 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 3 |
| 2018 | 2 |
| 2019 | 1 |
| 2020 | 1 |
| 2021 | 4 |
| 2022 | 4 |
| 2023 | 4 |
| 2024 | 5 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Curable adhesive composition comprising maleimide and thiol
US-2025382514-A1 · Dec 18, 2025 · US
Compound, composition, cured product, and method for producing compound
US-2025376465-A1 · Dec 11, 2025 · US
Copper foil with resin, and copper-clad laminate and printed wiring board using the same
US-2025296294-A1 · Sep 25, 2025 · US
Methods of reversible-addition fragmentation chain transfer step-growth polymerization and polymers therefrom
US-2025270352-A1 · Aug 28, 2025 · US
Cyclic ruthenium benzylidene initiators for enhanced ring expansion metathesis polymerization
US-2025026871-A1 · Jan 23, 2025 · US
Polymer, method for producing same, electrolyte composition, and battery
US-2025015349-A1 · Jan 9, 2025 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-12133339-B2 · Oct 29, 2024 · US
Composition containing organic semiconductor, solution for forming organic semiconductor layer, organic semiconductor layer, and organic thin film transistor
US-12101991-B2 · Sep 24, 2024 · US
Curable compound
US-12037319-B2 · Jul 16, 2024 · US
Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device
US-11905356-B2 · Feb 20, 2024 · US
High dielectric breakdown polymers; compositions; methods of making; and use thereof
US-11898000-B2 · Feb 13, 2024 · US
Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board
US-2023331944-A1 · Oct 19, 2023 · US
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device
US-2023305400-A1 · Sep 28, 2023 · US
Resin composition
US-2023059862-A1 · Feb 23, 2023 · US
Curable composition
US-2023054785-A1 · Feb 23, 2023 · US
Single-ion conductive polymers for electrochemical devices
US-11479626-B2 · Oct 25, 2022 · US
Bismaleimide Compound, Composition Containing Same, Polybenzoxazole, And Semiconductor Device
US-2022298281-A1 · Sep 22, 2022 · US
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
US-2022071025-A1 · Mar 3, 2022 · US
Composition containing organic semiconductor, solution for forming organic semiconductor layer, organic semiconductor layer, and organic thin film transistor
US-2022059768-A1 · Feb 24, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08F122/40?
- CPC C08F122/40 is the Cooperative Patent Classification code for “Imides, e.g. cyclic imides.”
- How many patents are filed under CPC C08F122/40 (Imides, e.g. cyclic imides)?
- Our database includes 35 publications tagged with this CPC code.
- Is patent activity under CPC C08F122/40 growing?
- Publication counts under this code: 5 in 2024 vs 6 in 2025 (latest complete years).