Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device

Patent metadata

Field	Value
Publication number	US-11905356-B2
Application number	US-202217685604-A
Country	US
Kind code	B2
Filing date	Mar 3, 2022
Priority date	Mar 16, 2021
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.

First claim

The invention claimed is:

1. A bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A):

wherein Y represents a direct bond or a divalent linking group, and
a carbon atom having a hydroxy group are directly bonded to each other, wherein the bismaleimide compound is represented by the following formula (1):

wherein ring a represents a benzene ring or a cyclohexane ring, X and Y each independently represent a direct bond or a divalent linking group, the plurality of Ys may be the same as or different from each other, Z represents a monovalent substituent bonded to ring a, when there is a plurality of Zs, Zs may be the same as or different from each other, and L and M each represent the number of substituents Zs and each independently represent an integer of 0 to 3.

2. The bismaleimide compound according to claim 1 , wherein X represents a direct bond or a divalent linking group containing one or more selected from the group consisting of a carbon atom, a fluorine atom, a sulfur atom, and an oxygen atom.

3. The bismaleimide compound according to claim 2 , wherein
X represents a direct bond or a divalent linking group represented by any one of the following formulas (a) to (f):

4. The bismaleimide compound according to claim 1 , wherein Y represents an alkylene group having 1 to 11 carbon atoms or an alkylene group having 1 to 11 carbon atoms and including a divalent aromatic group.

5. A composition comprising the bismaleimide compound according to claim 1 and a compound capable of reacting with a maleimide group.

6. A composition comprising the bismaleimide compound according to claim 1 and a photopolymerization initiator or a curing catalyst.

Assignees

• Nippon Kayaku Kk

Inventors

• Kawamoto Naoki
• Ko Firyon
• Koumoto Taihei

Classifications

• H10P76/20

  of masks comprising organic materials · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W20/48

  Insulating materials thereof · CPC title

• H10W74/473 Primary

  containing a filler · CPC title

• C08F222/408 Primary

  substituted imides comprising other heteroatoms · CPC title