Method of producing plating deposit
US-2024351943-A1 · Oct 24, 2024 · US
one metallic layer at least being obtained by electroless plating
one metallic layer at least being obtained by electroless plating · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C03C17/3697 |
| Official title | {one metallic layer at least being obtained by electroless plating} |
| Display label | one metallic layer at least being obtained by electroless plating |
| Total patents | 26 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 4 |
| 2017 | 1 |
| 2018 | 2 |
| 2019 | 3 |
| 2020 | 5 |
| 2021 | 2 |
| 2022 | 4 |
| 2023 | 2 |
| 2024 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plating film and plating film production method
US-11912612-B2 · Feb 27, 2024 · US
Plating film and plating film production method
US-2023391664-A1 · Dec 7, 2023 · US
Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer
US-11756847-B2 · Sep 12, 2023 · US
Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer
US-2022399242-A1 · Dec 15, 2022 · US
Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer
US-11456225-B2 · Sep 27, 2022 · US
Adhesion promoting layer, method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate, and conductive structure
US-2022177364-A1 · Jun 9, 2022 · US
Dynamic glass and method of formation
US-11292029-B2 · Apr 5, 2022 · US
Enhanced nickel plating process
US-11192822-B2 · Dec 7, 2021 · US
Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer
US-2021320041-A1 · Oct 14, 2021 · US
Interposer with manganese oxide adhesion layer
US-2020227277-A1 · Jul 16, 2020 · US
Enhanced nickel plating process
US-2020148589-A1 · May 14, 2020 · US
Dynamic Glass and Method of Formation
US-2020142273-A1 · May 7, 2020 · US
Methods for increasing adhesion between metallic films and glass surfaces and articles made therefrom
US-2020095684-A1 · Mar 26, 2020 · US
Coated glass sleeves and methods of coating glass sleeves
US-2020024184-A1 · Jan 23, 2020 · US
Methods of increasing adhesion between a conductive metal and an oxide substrate and articles made therefrom
US-2019363010-A1 · Nov 28, 2019 · US
Adhesion promoting process for metallisation of substrate surfaces
US-10487404-B2 · Nov 26, 2019 · US
Glass plate with film, touch sensor, film and method for producing glass plate with film
US-10457593-B2 · Oct 29, 2019 · US
Method and apparatus for fabrication of metal-coated optical fiber, and the resulting optical fiber
US-10126493-B2 · Nov 13, 2018 · US
Glass plate with film, touch sensor, film and method for producing glass plate with film
US-2018230043-A1 · Aug 16, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C03C17/3697?
- CPC C03C17/3697 is the Cooperative Patent Classification code for “one metallic layer at least being obtained by electroless plating.”
- How many patents are filed under CPC C03C17/3697 (one metallic layer at least being obtained by electroless plating)?
- Our database includes 26 publications tagged with this CPC code.
- Is patent activity under CPC C03C17/3697 growing?
- Publication counts under this code: 2 in 2023 vs 2 in 2024 (latest complete years).