Monolithic fabrication of thermally isolated microelectromechanical system (mems) devices
US-2016340174-A1 · Nov 24, 2016 · US
Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81B2201/025 |
| Official title | Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 |
| Display label | Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 |
| Total patents | 254 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 28 |
| 2016 | 35 |
| 2017 | 38 |
| 2018 | 33 |
| 2019 | 28 |
| 2020 | 15 |
| 2021 | 21 |
| 2022 | 22 |
| 2023 | 13 |
| 2024 | 11 |
| 2025 | 9 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Micromechanical pressure sensor device and corresponding manufacturing method
US-2016341616-A1 · Nov 24, 2016 · US
Micro electro mechanical system
US-9500666-B2 · Nov 22, 2016 · US
Integration of pressure sensors into integrated circuit fabrication and packaging
US-9501068-B2 · Nov 22, 2016 · US
MEMS vertical comb structure with linear drive/pickoff
US-9493344-B2 · Nov 15, 2016 · US
SOI substrate, physical quantity sensor, SOI substrate manufacturing method, and physical quantity sensor manufacturing method
US-9446938-B2 · Sep 20, 2016 · US
Micromechanical inertial sensor and method for manufacturing same
US-9434606-B2 · Sep 6, 2016 · US
Module, electronic apparatus and moving object
US-9426892-B2 · Aug 23, 2016 · US
Translating z axis accelerometer
US-2016214853-A1 · Jul 28, 2016 · US
Magnetic inertial sensor and method for operating the same
US-2016209440-A1 · Jul 21, 2016 · US
Microelectromechanical system (mems) on application specific integrated circuit (asic)
US-2016200566-A1 · Jul 14, 2016 · US
Integration of pressure sensors into integrated circuit fabrication and packaging
US-2016161957-A1 · Jun 9, 2016 · US
MEMS Integrated Pressure Sensor Devices Having Isotropic Cavitites and Methods of Forming Same
US-2016159643-A1 · Jun 9, 2016 · US
MEMS Integrated Pressure Sensor Devices and Methods of Forming Same
US-2016159644-A1 · Jun 9, 2016 · US
Composite wafer semiconductor
US-9346666-B2 · May 24, 2016 · US
MEMS device with differential vertical sense electrodes
US-9346670-B2 · May 24, 2016 · US
Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same
US-2016137491-A1 · May 19, 2016 · US
Manufacturing method of inertial sensor and inertial sensor
US-2016138921-A1 · May 19, 2016 · US
Magnetic inertial sensor and method for operating the same
US-9322839-B2 · Apr 26, 2016 · US
Electronic device, electronic module, electronic apparatus, and moving object
US-9321627-B2 · Apr 26, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81B2201/025?
- CPC B81B2201/025 is the Cooperative Patent Classification code for “Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242.”
- How many patents are filed under CPC B81B2201/025 (Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242)?
- Our database includes 254 publications tagged with this CPC code.
- Is patent activity under CPC B81B2201/025 growing?
- Publication counts under this code: 11 in 2024 vs 9 in 2025 (latest complete years).