MEMS Integrated Pressure Sensor Devices Having Isotropic Cavitites and Methods of Forming Same

Patent metadata

Field	Value
Publication number	US-2016159643-A1
Application number	US-201615041886-A
Country	US
Kind code	A1
Filing date	Feb 11, 2016
Priority date	Mar 14, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

A method embodiment includes providing a MEMS wafer comprising an oxide layer, a MEMS substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the MEMS, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer. The MEMS substrate is patterned, and portions of the sacrificial oxide layer are removed to form a first and second MEMS structure. A cap wafer including a second cavity is bonded to the MEMS wafer, wherein the bonding creates a first sealed cavity including the second cavity aligned to the first MEMS structure, and wherein the second MEMS structure is disposed between a second portion of the polysilicon layer and the cap wafer. Portions of the carrier wafer are removed so that first cavity acts as a channel to ambient pressure for the first MEMS structure.

First claim

What is claimed is:

1 . A method comprising:
disposing a first surface of a membrane for a first micro-electromechanical (MEMS) device in a first sealed cavity; and exposing a second surface of the membrane to an ambient pressure level, wherein exposing the second surface comprises:
patterning one or more openings in a carrier using a first etching process;
connecting bottom portions of the one or more openings using a second etching process to form a second cavity;
aligning the second cavity with the second surface of the membrane; and
exposing the second cavity to the ambient pressure level.

2 . The method of claim 1 , wherein disposing a first surface of the membrane is in the first sealed cavity comprises bonding a cap to a plurality of conductive bonds formed over the membrane, and wherein a pressure level of the first sealed cavity is defined by a eutectic bonding process used to bond the cap the plurality of conductive bonds.

3 . The method of claim 1 further comprising forming a first MEMS structure aligned with the membrane for the first MEMS device, wherein forming the first MEMS structure comprises:
providing a wafer comprising the membrane, a substrate, and an oxide release layer;
patterning the substrate to define a shape of the first MEMS structure; and
removing portions of the oxide release layer.

4 . The method of claim 3 further comprising:
forming a second MEMS structure adjacent the first MEMS structure; and
disposing the second MEMS structure in a third sealed cavity, wherein disposing the second MEMS structure in the third sealed cavity comprises bonding a cap to a plurality of conductive bonds formed over the membrane, and wherein a pressure level of the third sealed cavity is defined by a eutectic bonding process used to bond the cap the plurality of conductive bonds.

5 . The method of claim 4 further comprising:
patterning one or more additional openings in the carrier using the first etching process;
connecting bottom portions of the one or more openings using the second etching process to form a portion of the third sealed cavity; and
aligning the third sealed cavity with the second MEMS structure, wherein the pressure level of the third sealed cavity is further defined by a volume of the portion of the third sealed cavity in the carrier.

6 . The method of claim 1 , wherein the second etching process is an isotropic etching process.

7 . The method of claim 1 further comprising:
forming a protection layer on sidewalls of the one or more openings; and
after connecting the bottom portions of the one or more openings, removing the protection layer.

8 . The method of claim 1 , wherein patterning the one or more openings comprises patterning one or more openings having varying depths by controlling a respective width of each of the one or more openings.

9 . A device comprising:
a membrane of a micro-electromechanical (MEMS) device; a first sealed cavity aligned with the membrane, wherein a first surface of the membrane is exposed to a first pressure level of the first sealed cavity; and a substrate comprising a second cavity aligned with the membrane, wherein the second cavity comprises:
a first portion extending partially into the substrate, wherein a material of the substrate is disposed under the first portion of the second cavity; and
a second portion connected to the first portion, wherein the second portion extends through the substrate and exposes a second surface of the membrane to an ambient pressure level.

10 . The device of claim 9 , wherein at least a portion of the first sealed cavity is disposed in a cap, and wherein the cap is bonded to a plurality of conductive bonds disposed over the membrane.

11 . The device of claim 9 further comprising a first MEMS structure disposed in the first sealed cavity.

12 . The device of claim 11 further comprising a second MEMS structure adjacent the first MEMS structure and disposed in a third sealed cavity.

13 . The device of claim 12 , wherein at least a portion of the third sealed cavity is disposed in the substrate, and wherein the third sealed cavity comprises a upper portion and a lower portion wider than the upper portion.

14 . A device comprising:
a micro-electromechanical (MEMS) portion comprising:
a membrane of a first MEMS device; and
a first MEMS structure higher than the membrane, wherein the first MEMS structure is part of a second MEMS device;
a carrier bonded to the MEMS portion, wherein a first surface of the membrane is exposed to ambient pressure by a first cavity extending through the carrier; and a cap bonded to the MEMS portion, wherein the cap and the MEMS portion define a second cavity and a third cavity, and wherein:
a second surface of the membrane is exposed to a sealed pressure level of the second cavity; and
the first MEMS structure is disposed in the third cavity.

15 . The device of claim 14 , wherein the first MEMS device is a pressure sensor device, and wherein the second MEMS device provides a different function than the first MEMS device.

16 . The device of claim 15 , wherein the second MEMS device is a motion sensor, a gyroscope, or an accelerometer.

17 . The device of claim 14 , wherein the MEMs portion further comprises a second MEMS structure adjacent the first MEMS structure and aligned with the membrane, and wherein the second MEMS structure is disposed in the first cavity.

18 . The device of claim 14 , wherein the first cavity comprises:
an upper portion comprising a first opening, the upper portion having a first width; and a lower portion connected to the upper portion, the lower portion having a second width, wherein the first width is less than the second width.

19 . The device of claim 14 , wherein the first cavity comprises:
a first portion, wherein a material of the carrier extends under the first portion; and a second portion adjacent the first portion, wherein the second portion extends through the carrier.

20 . The device of claim 14 , wherein the third cavity extends at least partially into the carrier.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Chu Chia-Hua
• Cheng Chun-Wen

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/60

  Seals · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title