Top notch slit profile for mems device
US-2024381034-A1 · Nov 14, 2024 · US
Through-holes, i.e. extending from one face to the other face of the wafer · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81B1/004 |
| Official title | {Through-holes, i.e. extending from one face to the other face of the wafer} |
| Display label | Through-holes, i.e. extending from one face to the other face of the wafer |
| Total patents | 81 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 3 |
| 2017 | 6 |
| 2018 | 8 |
| 2019 | 5 |
| 2020 | 14 |
| 2021 | 9 |
| 2022 | 10 |
| 2023 | 4 |
| 2024 | 3 |
| 2025 | 9 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024381034-A1 · Nov 14, 2024 · US
US-11453911-B2 · Sep 27, 2022 · US
US-2022227622-A1 · Jul 21, 2022 · US
US-2022112073-A1 · Apr 14, 2022 · US
US-11268928-B2 · Mar 8, 2022 · US
US-11243145-B2 · Feb 8, 2022 · US
US-11203522-B2 · Dec 21, 2021 · US
US-2021229982-A1 · Jul 29, 2021 · US
US-2021211071-A1 · Jul 8, 2021 · US
US-2021181070-A1 · Jun 17, 2021 · US
US-2021146357-A1 · May 20, 2021 · US
US-10967373-B2 · Apr 6, 2021 · US
US-10967372-B2 · Apr 6, 2021 · US
US-10955318-B2 · Mar 23, 2021 · US
US-10941033-B2 · Mar 9, 2021 · US
US-2020400990-A1 · Dec 24, 2020 · US
US-2020369511-A1 · Nov 26, 2020 · US
US-2020369512-A1 · Nov 26, 2020 · US
US-2020361766-A1 · Nov 19, 2020 · US
US-2020340889-A1 · Oct 29, 2020 · US
Answers are generated from the same data shown on this page.