Through-holes, i.e. extending from one face to the other face of the wafer

Through-holes, i.e. extending from one face to the other face of the wafer · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB81B1/004
Official title{Through-holes, i.e. extending from one face to the other face of the wafer}
Display labelThrough-holes, i.e. extending from one face to the other face of the wafer
Total patents81

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
20159
20163
20176
20188
20195
202014
20219
202210
20234
20243
20259
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B81B1/004?
CPC B81B1/004 is the Cooperative Patent Classification code for “Through-holes, i.e. extending from one face to the other face of the wafer.”
How many patents are filed under CPC B81B1/004 (Through-holes, i.e. extending from one face to the other face of the wafer)?
Our database includes 81 publications tagged with this CPC code.
Is patent activity under CPC B81B1/004 growing?
Publication counts under this code: 3 in 2024 vs 9 in 2025 (latest complete years).