In-situ grinding wheel topography, power monitoring, and feed/speed scheduling systems and methods
US-12589459-B2 · Mar 31, 2026 · US
Wear compensation without the presence of dressing tools
Wear compensation without the presence of dressing tools · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B49/183 |
| Official title | {Wear compensation without the presence of dressing tools} |
| Display label | Wear compensation without the presence of dressing tools |
| Total patents | 29 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 5 |
| 2020 | 1 |
| 2021 | 2 |
| 2022 | 1 |
| 2023 | 7 |
| 2024 | 2 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same
US-2025360595-A1 · Nov 27, 2025 · US
Method for manufacturing an ophthalmic device comprising machining
US-2025312878-A1 · Oct 9, 2025 · US
Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same
US-12415248-B2 · Sep 16, 2025 · US
Polishing system and method of polishing a component
US-2025153308-A1 · May 15, 2025 · US
Method of helical chamfer machining silicon wafer
US-12191152-B2 · Jan 7, 2025 · US
Determination of substrate layer thickness with polishing pad wear compensation
US-12090599-B2 · Sep 17, 2024 · US
Robotic polishing system and method for using same
US-2024208004-A1 · Jun 27, 2024 · US
Determination of substrate layer thickness with polishing pad wear compensation
US-2023381912-A1 · Nov 30, 2023 · US
Determination of substrate layer thickness with polishing pad wear compensation
US-11780047-B2 · Oct 10, 2023 · US
Grinding robot and method for grinding electrically conductive workpieces
US-11772233-B2 · Oct 3, 2023 · US
In-situ grinding wheel topography, power monitoring, and feed/speed scheduling systems and methods
US-2023241741-A1 · Aug 3, 2023 · US
System and method for conducting an abrasive operation
US-2023158637-A1 · May 25, 2023 · US
Substrate polishing apparatus, substrate polishing method using the same, and semiconductor fabrication method including the same
US-2023052061-A1 · Feb 16, 2023 · US
Grinding apparatus
US-11541507-B2 · Jan 3, 2023 · US
Polishing apparatus
US-11224956-B2 · Jan 18, 2022 · US
Determination of substrate layer thickness with polishing pad wear compensation
US-2021402551-A1 · Dec 30, 2021 · US
Method of helical chamfer machining silicon wafer
US-2021327718-A1 · Oct 21, 2021 · US
Abrasive article including a wear detection sensor
US-2020039027-A1 · Feb 6, 2020 · US
Grinding robot and method for grinding electrically conductive workpieces
US-2019344400-A1 · Nov 14, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B49/183?
- CPC B24B49/183 is the Cooperative Patent Classification code for “Wear compensation without the presence of dressing tools.”
- How many patents are filed under CPC B24B49/183 (Wear compensation without the presence of dressing tools)?
- Our database includes 29 publications tagged with this CPC code.
- Is patent activity under CPC B24B49/183 growing?
- Publication counts under this code: 2 in 2024 vs 5 in 2025 (latest complete years).