Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Patent metadata

Field	Value
Publication number	US-9687957-B2
Application number	US-201414530589-A
Country	US
Kind code	B2
Filing date	Oct 31, 2014
Priority date	Jun 4, 2008
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

First claim

What is claimed:

1. A polishing apparatus comprising:
a wafer holder configured to hold a wafer;
a top ring comprising a top ring body and a retainer ring movable relative to the top ring body;
a ring supporter configured to support the retainer ring when the wafer is transferred from the wafer holder to the top ring and/or when the wafer is transferred from the top ring to the wafer holder;
a polishing table configured to polish the wafer transferred to the top ring; and
a sensor configured to detect whether the wafer is present on the wafer holder,
wherein the top ring body comprises a wafer holding member configured to hold the wafer transferred from the wafer holder, the wafer holding member being located inside the retainer ring, and
wherein a bottom face of the retainer ring moves, when the retainer ring is supported by the ring supporter, to a first position above a second position where the wafer is to be hold by the wafer holding member when the wafer is transferred from the wafer holder to the top ring and/or when the wafer is transferred from the top ring to the wafer holder.

2. The apparatus of claim 1 , wherein the wafer is transferred from the wafer holder to the top ring and/or the wafer is transferred from the top ring to the wafer holder while the ring supporter is supporting the retainer ring.

3. The apparatus of claim 1 further comprising a guide configured to guide the top ring when the top ring and the wafer holder are brought close to each other such that the wafer held by the wafer holder contacts a bottom face of the top ring.

4. The apparatus of claim 3 , wherein the top ring and the wafer holder are brought close to each other by moving the top ring and the wafer holder in a vertical direction.

5. The apparatus of claim 3 , wherein the guide is on a circumference of the wafer holder.

6. The apparatus of claim 3 , wherein an inner side of the guide is tapered.

7. The apparatus of claim 1 further comprising a wear measuring device configured to measure an amount of wear of the retainer ring.

8. The apparatus of claim 1 , wherein the wafer holder is a transfer stage.

9. The apparatus of claim 1 , wherein the ring supporter comprises a push-up mechanism configured to contact the retainer ring when the wafer is transferred from the wafer holder to the top ring and/or the wafer is transferred from the top ring to the wafer holder.

10. A polishing method comprising:
detecting whether a wafer is present on a wafer holder;
transferring the wafer from the wafer holder to a top ring comprising a top ring body and a retainer ring movable relative to the top ring body;
polishing the wafer transferred to the top ring; and
transferring the polished wafer from the top ring to the wafer holder,
wherein
the wafer is transferred from the wafer holder to the top ring while the retainer ring is supported, and/or
the wafer is transferred from the top ring to the wafer holder while the retainer ring is supported,

wherein the top ring body comprises a wafer holding member configured to hold the transferred wafer, the wafer holding member being located inside the retainer ring, and
wherein a bottom face of the retainer ring moves, when the retainer ring is supported, to a first position above a second position where the wafer is to be hold by the wafer holding member.

11. The method of claim 10 further comprising, before transferring the wafer from the wafer holder to the top ring, bringing the top ring and the wafer close to each other while guiding the top ring such that the wafer contacts a bottom face of the top ring.

12. The method of claim 11 , wherein the top ring and the wafer are brought close to each other by moving the top ring and the wafer in a vertical direction.

13. The method of claim 10 further comprising measuring an amount of wear of the retainer ring.

14. A polishing method comprising:
transferring a wafer from a front loader to a transfer apparatus;
transferring the wafer from the transfer apparatus to a wafer holder;
detecting whether the wafer is present on the wafer holder;
bringing a top ring and the wafer held by the wafer holder close to each other, the top ring comprising a top ring body and a retainer ring movable relative to the top ring body, and supporting the retainer ring;
transferring the wafer to the top ring while the retainer ring is supported; and
polishing the wafer transferred to the top ring,
wherein the top ring body comprises a wafer holding member configured to hold the transferred wafer, the wafer holding member being located inside the retainer ring, and
wherein a bottom face of the retainer ring moves, when the retainer ring is supported, to a first position above a second position where the wafer is to be hold by the wafer holding member.

15. The method of claim 14 further comprising transferring the polished wafer from the top ring to the wafer holder while the retainer ring is supported.

16. A polishing apparatus comprising:
a wafer holder configured to hold a wafer;
a top ring comprising a top ring body and a retainer ring movable relative to the top ring body;
a ring supporter configured to support the retainer ring when the wafer is transferred from the wafer holder to the top ring and/or when the wafer is transferred from the top ring to the wafer holder;
a polishing table configured to polish the wafer transferred to the top ring; and
a wear measuring device configured to measure an amount of wear of the retainer ring,
wherein the top ring body comprises a wafer holding member configured to hold the wafer transferred from the wafer holder, the wafer holding member being located inside the retainer ring, and
wherein a bottom face of the retainer ring moves, when the retainer ring is supported by the ring supporter, to a first position above a second position where the wafer is to be hold by the wafer holding member.

17. A polishing method comprising:
transferring a wafer from a wafer holder to a top ring comprising a top ring body and a retainer ring movable relative to the top ring body;
polishing the wafer transferred to the top ring;
measuring an amount of wear of the retainer ring; and
transferring the polished wafer from the top ring to the wafer holder,
wherein
the wafer is transferred from the wafer holder to the top ring while the retainer ring is supported, and/or
the wafer is transferred from the top ring to the wafer holder while the retainer ring is supported,

wherein the top ring body comprises a wafer holding member configured to hold the transferred wafer, the wafer holding member being located inside the retainer ring, and
wherein a bottom face of the retainer ring moves, when the retainer ring is supported, to a first position above a second position where the wafer is to be hold by the wafer holding member.

18. A polishing method comprising:
transferring a wafer from a front loader to a transfer apparatus;
transferring the wafer from the transfer apparatus to a wafer holder;
bringing a top ring and the wafer hold by the wafer holder close to each other, the top ring comprising a top ring body and a retainer ring movable relative to the top ring body, and supporting the retainer ring;
transferring the wafer to the top ring while the retainer ring is supported;
polishing the wafer transferred to the top ring; and
measuring an amount of wear of the retainer ring,
wherein the top ring body comprises a wafer holding member configured to hold the transferred wafer, the wafer holding member being located inside the retai

Assignees

• Ebara Corp

Inventors

• Miyazaki Mitsuru
• Katsuoka Seiji
• Matsuda Naoki
• Kunisawa Junji
• Kobayashi Kenichi
• Sotozaki Hiroshi
• Shinozaki Hiroyuki
• Nabeya Osamu
• Morisawa Shinya
• Ogawa Takahiro
• Makino Natsuki

Classifications

• H10P72/3311

  Horizontal transfer of a batch of workpieces · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0472

  comprising at least one polishing chamber · CPC title

• H10P72/33

  into and out of processing chamber · CPC title

• H10P52/402

  of semiconductor materials · CPC title