Oxide-containing plate-shaped copper particle, paste composition, semiconductor device, electrical component and electronic component
US-2025214180-A1 · Jul 3, 2025 · US
comprising compounds which yield metals when heated · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/34 |
| Official title | comprising compounds which yield metals when heated |
| Display label | comprising compounds which yield metals when heated |
| Total patents | 58 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 3 |
| 2017 | 10 |
| 2018 | 6 |
| 2019 | 7 |
| 2020 | 3 |
| 2021 | 3 |
| 2022 | 2 |
| 2023 | 3 |
| 2024 | 1 |
| 2025 | 5 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2025214180-A1 · Jul 3, 2025 · US
US-12343820-B2 · Jul 1, 2025 · US
US-2025205831-A1 · Jun 26, 2025 · US
US-2025192089-A1 · Jun 12, 2025 · US
US-12257651-B2 · Mar 25, 2025 · US
US-2024408704-A1 · Dec 12, 2024 · US
US-11780020-B2 · Oct 10, 2023 · US
US-2023101214-A1 · Mar 30, 2023 · US
US-11541470-B2 · Jan 3, 2023 · US
US-2022314352-A1 · Oct 6, 2022 · US
US-2022288726-A1 · Sep 15, 2022 · US
US-11045910-B2 · Jun 29, 2021 · US
US-11020825-B2 · Jun 1, 2021 · US
US-10946465-B2 · Mar 16, 2021 · US
US-10828865-B1 · Nov 10, 2020 · US
US-10799974-B2 · Oct 13, 2020 · US
US-10668571-B2 · Jun 2, 2020 · US
US-10421141-B2 · Sep 24, 2019 · US
US-10335881-B2 · Jul 2, 2019 · US
US-2019184498-A1 · Jun 20, 2019 · US
Answers are generated from the same data shown on this page.