Metal paste and use thereof for joining components

Patent metadata

Field	Value
Publication number	US-11045910-B2
Application number	US-201615580750-A
Country	US
Kind code	B2
Filing date	Aug 2, 2016
Priority date	Sep 4, 2015
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 μm. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

First claim

The invention claimed is:

1. A metal sintering paste comprising:
(A) 70 to 90% by weight copper and/or silver particles that comprise a coating that contains at least one organic compound,
(B) 5 to 20% by weight organic solvent, and
(C) 2 to 20% by weight of at least one type of metal particles that are different from particles (A) and have a mean particle size (d50) in the range of 0.2 to 10 μm,
wherein the metal particles of component (C) are nickel core-silver jacket particles with a silver content of 15 to 30% by weight.

2. The metal sintering paste of claim 1 , wherein the copper and/or silver particles (A) take the shape of flakes.

3. The metal sintering paste of claim 1 , wherein the at least one organic compound is selected from the group consisting of free fatty acids, fatty acid salts, and fatty acid esters.

4. The metal sintering paste of claim 1 , wherein the nickel core-silver jacket particles have a silver content of 25% by weight.

5. The metal sintering paste of claim 1 , wherein the particles (C) comprise neither flakes nor needles.

6. The metal sintering paste of claim 5 , wherein the particles (C) comprise a shape factor in the range of 1 to 3.

7. The metal sintering paste of claim 1 , further comprising up to 12% by weight of at least one metal precursor (D), 0 to 10% by weight of at least one sintering aid (E), and 0 to 15% by weight of one or more further ingredients (F) selected from dispersion agents, surfactants, de-foaming agents, binding agents, polymers and/or viscosity-controlling (rheological) agents.

8. The metal sintering paste of claim 1 , wherein the paste comprises 70 to 80% by weight of the copper and/or silver particles.

9. The metal sintering paste of claim 1 , further comprising up to 12% by weight of at least one metal precursor (D).

10. The metal sintering paste of claim 1 , further comprising up to 10% by weight of at least one sintering aid (E).

11. The metal sintering paste of claim 1 , further comprising up to 15% by weight of one or more further ingredients (F) selected from dispersion agents, surfactants, de-foaming agents, binding agents, polymers and/or viscosity-controlling (rheological) agents.

12. The metal sintering paste of claim 11 , wherein the one or more further ingredients (F) is a polymer, the polymer being a cellulose derivative.

13. The metal sintering paste of claim 12 , wherein the cellulose derivative is ethylcellulose.

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Schmitt Wolfgang
• Krebs Thomas
• Schäfer Michael
• Duch Susanne K
• Nachreiner Jens

Classifications

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W72/30

  Die-attach connectors · CPC title

• B22F1/068

  Flake-like particles · CPC title