Connecting material and connection structure

Patent metadata

Field	Value
Publication number	US-11020825-B2
Application number	US-201615767804-A
Country	US
Kind code	B2
Filing date	Nov 18, 2016
Priority date	Nov 20, 2015
Publication date	Jun 1, 2021
Grant date	Jun 1, 2021

Abstract

A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

First claim

The invention claimed is:

1. A connecting material comprising:
resin particles; and
metal atom-containing particles,
the resin particles having an average particle diameter of 1 μm or more and 300 μm or less,
the resin particles having a 10% K value of exceeding 3000 N/mm 2 and 20000 N/mm 2 or less,
the resin particles having a particle diameter CV value of 10% or less,
the resin particles having a thermal decomposition temperature of 200° C. or more, and
the metal atom-containing particles being metal atom-containing particles that are capable of being sintered by heating at less than 400° C.

2. The connecting material according to claim 1 , wherein
the resin particles have the number of aggregated particles per million particles of the particles of 100 or less.

3. The connecting material according to claim 1 , wherein
a material for the resin particles contains a vinyl compound, a (meth)acrylic compound, an α-olefin compound, a diene compound, or a silicone compound.

4. The connecting material according to claim 1 , wherein
the thermal decomposition temperature of the resin particles is higher than a melting point of the metal atom-containing particles.

5. The connecting material according to claim 1 , further comprising a resin.

6. A connection structure, comprising:
a first member to be connected;
a second member to be connected; and
a connection part that connects the first member to be connected and the second member to be connected,
a material for the connection part being the connecting material according to claim 1 .

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Yamagami Mai
• Haneda Satoshi
• Wakiya Takeshi
• Yamada Yasuyuki
• Ueda Saori
• Sasadaira Masao

Classifications

• B22F1/18

  Non-metallic particles coated with metal · CPC title

• B22F1/10

  Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

• B22F1/052

  characterised by a mixture of particles of different sizes or by the particle size distribution · CPC title

• B22F1/05

  Metallic powder characterised by the size or surface area of the particles · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title