Additive layer repair of a metallic component
US-10487659-B2 · Nov 26, 2019 · US
with the principal constituent melting at more than 1550°C
with the principal constituent melting at more than 1550°C · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/32 |
| Official title | with the principal constituent melting at more than 1550°C |
| Display label | with the principal constituent melting at more than 1550°C |
| Total patents | 100 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 21 |
| 2017 | 16 |
| 2018 | 4 |
| 2019 | 18 |
| 2020 | 9 |
| 2021 | 9 |
| 2022 | 5 |
| 2023 | 4 |
| 2024 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Ceramic circuit substrate and method for producing ceramic circuit substrate
US-10485112-B2 · Nov 19, 2019 · US
Method for producing a connection between two ceramic parts—in particular, of parts of a pressure sensor
US-10435330-B2 · Oct 8, 2019 · US
Method of cleaning a workpiece after a thermal joining process with cathodic cleaning; cleaning device and processing gas
US-2019299314-A1 · Oct 3, 2019 · US
Display device having an electronic device disposed on a first pad and a second pad
US-2019296202-A1 · Sep 26, 2019 · US
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US-10375825-B2 · Aug 6, 2019 · US
Ceramic circuit substrate and method for producing ceramic circuit substrate
US-2019150298-A1 · May 16, 2019 · US
Deposition of braze preform
US-10252365-B2 · Apr 9, 2019 · US
Method for joining heat transfer plates of a plate heat exchanger
US-2019030654-A1 · Jan 31, 2019 · US
Metallic particle paste, cured product using same, and semiconductor device
US-10086478-B2 · Oct 2, 2018 · US
Wear-resistant member and wear-resistant member production method
US-2018214993-A1 · Aug 2, 2018 · US
Joining metallurgically incompatible metals
US-2018161931-A1 · Jun 14, 2018 · US
Assembly having at least two ceramic bodies joined with one another, especially a pressure measuring cell, and method for joining ceramic bodies by means of an active hard solder, or braze
US-9931717-B2 · Apr 3, 2018 · US
Active brazing material and method for active brazing of components
US-2017348783-A1 · Dec 7, 2017 · US
Ceramic pressure measuring cell and method for its manufacture
US-9816887-B2 · Nov 14, 2017 · US
Method for producing a connection between two ceramic parts - in particular, of parts of a pressure sensor
US-2017305799-A1 · Oct 26, 2017 · US
Cladding alloy powder and method for producing engine valve using the same
US-2017297149-A1 · Oct 19, 2017 · US
Solder, aluminum wire body and motor using the same
US-9789568-B2 · Oct 17, 2017 · US
Deposition of braze preform
US-2017282273-A1 · Oct 5, 2017 · US
Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
US-9707642-B2 · Jul 18, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/32?
- CPC B23K35/32 is the Cooperative Patent Classification code for “with the principal constituent melting at more than 1550°C.”
- How many patents are filed under CPC B23K35/32 (with the principal constituent melting at more than 1550°C)?
- Our database includes 100 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/32 growing?
- Publication counts under this code: 4 in 2023 vs 4 in 2024 (latest complete years).