Diffusion soldering preform with varying surface profile
US-11764185-B2 · Sep 19, 2023 · US
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Cd as the principal constituent
Cd as the principal constituent · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/266 |
| Official title | {Cd as the principal constituent} |
| Display label | Cd as the principal constituent |
| Total patents | 6 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity appears to be growing based on the most recent years.
| Year | Patents |
|---|---|
| 2017 | 1 |
| 2019 | 2 |
| 2021 | 1 |
| 2023 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Diffusion soldering preform with varying surface profile
US-2023065738-A1 · Mar 2, 2023 · US
Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint
US-11052492-B2 · Jul 6, 2021 · US
Filler additives to avoid weld cracking
US-2019308280-A1 · Oct 10, 2019 · US
Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint
US-2019134760-A1 · May 9, 2019 · US
Toughened solder for downhole applications, methods of manufacture thereof and articles comprising the same
US-9707642-B2 · Jul 18, 2017 · US