Laser dicing glass wafers using advanced laser sources
US-2024409449-A1 · Dec 12, 2024 · US
for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/55 |
| Official title | for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns |
| Display label | for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns |
| Total patents | 175 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 16 |
| 2016 | 15 |
| 2017 | 15 |
| 2018 | 16 |
| 2019 | 19 |
| 2020 | 22 |
| 2021 | 15 |
| 2022 | 20 |
| 2023 | 7 |
| 2024 | 18 |
| 2025 | 6 |
| 2026 | 6 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024409449-A1 · Dec 12, 2024 · US
US-10155683-B2 · Dec 18, 2018 · US
US-10144093-B2 · Dec 4, 2018 · US
US-10131019-B2 · Nov 20, 2018 · US
US-2018304352-A1 · Oct 25, 2018 · US
US-10086476-B2 · Oct 2, 2018 · US
US-2018186680-A1 · Jul 5, 2018 · US
US-2018186677-A1 · Jul 5, 2018 · US
US-2018141154-A1 · May 24, 2018 · US
US-9978004-B2 · May 22, 2018 · US
US-2018111230-A1 · Apr 26, 2018 · US
US-9919383-B2 · Mar 20, 2018 · US
US-9913700-B2 · Mar 13, 2018 · US
US-9873167-B1 · Jan 23, 2018 · US
US-2017364778-A1 · Dec 21, 2017 · US
US-2017351156-A1 · Dec 7, 2017 · US
US-9789565-B2 · Oct 17, 2017 · US
US-2017291844-A1 · Oct 12, 2017 · US
US-2017239748-A1 · Aug 24, 2017 · US
US-2017232558-A1 · Aug 17, 2017 · US
Answers are generated from the same data shown on this page.